DELO Adhesive Reference Applications

Inseto is the exclusive UK and Ireland distributor for DELO Industrial Adhesives, supplying adhesive application solutions for bonding, sealing, encapsulation, potting and structural joining across aerospace, automotive, electronics, medical, glass, industrial, microelectronic and plastic sectors. Every DELO adhesive draws on chemistry, viscosity and cure profile matched to the exact substrate, component design and operating environment involved so that you receive the best bond for any type of application.

Inseto supports each adhesive application with technical guidance, sample testing and process development, helping engineers move from material selection through to a proven production process.

Get in touch today to discuss an adhesive that suits your needs.

What Adhesive Industry Applications Do We Offer?

• Aerospace: structural bonding, sealing and protective adhesive applications for composite and metallic components. These adhesives carry certified performance data on fatigue resistance, outgassing and thermal cycling, supporting airframe assembly, interior fit-out and sensor installation where every joint faces sustained mechanical stress.
• Automotive: bonding, sealing and protective adhesive applications across sensors, motors, cameras and control modules. Formulations manage the strain from repeated thermal expansion and vibration over a vehicle’s working life, while fast cure speeds keep pace with high volume production lines.
• Electronic: adhesive applications for bonding, fixing and encapsulating components on circuit boards and housings. Low ionic content protects sensitive electronics from corrosion, while controlled cure profiles support automated dispensing and consistent output across large production runs.
• Glass: display and optical bonding adhesive applications built on optically clear, fast curing formulations. These adhesives hold tight alignment tolerances during assembly and resist yellowing over time, keeping displays, lenses and cover glass free of visible distortion.
• Industrial: structural bonding and gap filling adhesive applications used across motor assembly, magnet fixing and general mechanical joining. These adhesives replace welding, riveting and mechanical fasteners in many designs, cutting assembly weight and spreading load more evenly across the joint.
• Medical: biocompatible adhesive applications for bonding, sealing and encapsulating diagnostic devices, wearables and drug delivery systems. Formulations meet biocompatibility and sterilisation requirements, supporting manufacturers working to strict regulatory standards.
• Microelectronic: high purity adhesive applications for die attach, glob top, dam and fill, and MEMS packaging. These adhesives control stress transfer to delicate components, offering the electrical and thermal properties needed to protect sensitive devices over years of operation.
• Plastic: adhesive applications formulated for strong adhesion to low energy substrates such as polypropylene and PTFE. These adhesives accommodate the thermal movement common in lightweight assemblies, holding a durable bond without pre-treatment on many plastic grades.