DELO KATIOBOND Cationic UV and Light Curing Epoxy Adhesives

What is the Pre-Activation Process?

DELO KATIOBOND adhesives support a pre-activation process, which gives production lines greater flexibility when bonding complex or opaque assemblies.

In pre-activation, the adhesive is exposed to visible light before the components are joined. This initiates the cationic curing reaction and gives the adhesive a defined open time, during which the components can be accurately positioned and brought together. After joining, a short secondary light exposure of around 10 seconds achieves initial handling strength, with full cure completing at room temperature without further irradiation.

Pre-activation is particularly useful where:

• The bond area will be completely obscured once the components are joined, preventing any post-assembly light exposure
• Precise component placement is required before the adhesive begins to cure
• Production cycle times need to remain short without relying on a batch oven or humidity chamber for secondary cure

Electronics and PCB Assembly

DELO KATIOBOND adhesives are used in electronic component assembly for bonding and securing SMDs, PCB potting, and wire tacking. Low shrinkage and low ionic content reduce mechanical stress on sensitive components and minimise the risk of electrochemical migration on populated boards.

RFID and Smart Card Manufacturing

In RFID and smart card assembly, DELO KATIOBOND adhesives bond and encapsulate antenna elements and chip modules to card substrates. The dark cure property ensures full polymerisation beneath bonded layers that block direct UV exposure, removing the need for a secondary cure step in the production process.

Potting and Encapsulation

DELO KATIOBOND adhesives in higher viscosity grades, up to 180,000 mPa.s, are used for potting and encapsulation of electronic assemblies. The dark cure property allows full polymerisation inside enclosed housings where light access is limited or impossible after assembly.

What is the dark cure or shadow cure property of DELO KATIOBOND?

When visible light activates a DELO KATIOBOND adhesive, it triggers a catalyst through cationic polymerisation that continues driving the curing reaction even after the light source is removed. This means the adhesive fully cures in shadow zones, beneath bonded components, and inside enclosed assemblies without requiring a secondary heat or humidity cure step.

What viscosity grades does DELO KATIOBOND come in?

DELO KATIOBOND adhesives are available in viscosities from 1,300 to 180,000 mPa.s. Lower viscosity grades are suited to fine dispensing, capillary flow, and thin bond line applications. Higher viscosity grades are used for gasketing, dam-and-fill, and potting applications where the adhesive needs to hold its shape before cure.

What temperature resistance does DELO KATIOBOND offer?

DELO KATIOBOND cationic epoxy adhesives offer temperature resistance up to 180°C, making them suitable for automotive under-bonnet applications, sensor sealing, and other assemblies that experience sustained high temperatures or repeated thermal cycling in service.

Can I get samples or technical support from Inseto?

Inseto provides technical support, product documentation, and samples for DELO KATIOBOND adhesives. As the exclusive UK and Ireland DELO distributor, Inseto can advise on product selection, dispensing and curing equipment, and process setup. Send an enquiry using the form below or call us on +44 (0)1264 334505.