Die Attach Adhesive
Reliability is paramount for die attach in microelectronic applications, whether the end-product is for a military or commercial application. DELO’s high-purity, low CTE epoxy die attach adhesive range provides the perfect combination for use in all applications. With excellent adhesion to a wide variety of substrates (FR4, gold-plated alumina, etc.) and an extended working life, DELO’s conductive and non-conductive die bonding adhesives meet an extensive range of customer requirements and specifications.
What are Die Attach Adhesives?
Die attach adhesives are specialised materials used to bond semiconductor dies to substrates, packages or leadframes during microelectronic assembly, providing the mechanical and thermal interface essential for device reliability. They are commonly used instead of solder where lower processing temperatures, reduced stress, or compatibility with small geometries is required.
Depending on the application, these adhesives can be electrically conductive, electrically insulating, thermally conductive, or a combination of these, supporting use across semiconductor, hybrid microelectronic, MEMS, and PCB‑based chip‑on‑board applications etc.
Key Features of Die Attach Adhesives
- High purity adhesives optimised for minimum outgassing
- Cure options include fast curing in seconds
- Light-fixing capability significantly reduces process times
- Added benefit of precise placement accuracy – elimination of movement during heat-cure
- Increased temperature stability, up to 250°C, in some instances
- Very low cure temperature of 60°C also available
- Electrically & thermally conductive and non-conductive options
Die Attach Adhesives Resources
DELO Process Solutions for Die Attach Brochure
DELO Bonding in Electronics Brochure
Die Attach Adhesives for Specific Applications
The adhesives are used in widely differing die bond applications, including semiconductor assembly onto leadframes, microelectronic hybrid assembly onto alumina, commercial FR4 applications, etc.
DELO has developed products specifically designed for such applications, featuring:
- A wide die attach adhesive product range for a variety of substrates
- High throughout due to reduced cycle times and innovative processes such as light-fixing
- Reduced costs as a result of extended processing times
- High temperature stability up to 250°C allowing for lead-free assembly
- Low humidity sensitivity with < 0.3% water absorption
- High purity with < 10ppm ionic impurities
Developments in Die Attach Adhesives
New developments include dual-curing die attach adhesives that allow very fast fixing of the components by illuminating the adhesive fillet with UV light, and subsequent curing of the adhesive under the component by the application of heat, whether at wire-bonding, over-moulding, or encapsulation.
With an increasing number of temperature-sensitive substrates being used in electronic applications, DELO has also developed a range of adhesives that use a low-temperature chemistry, curing at 60°C.
Please see our adhesive applications for examples using DELO die attach adhesives.
Key Characteristics of Die Attach Adhesives
- High‑purity, low‑ionic formulations designed for use in microelectronic assembly
- Engineered to provide mechanical bonding, with or without electrical conductivity
- Compatible with a wide range of substrates and material finishes
- Available with a range of curing mechanisms, including heat‑cure, light‑cure, and dual‑cure
Got a Question About Die Attach Adhesives?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right die attach adhesive to optimising your processes, we provide technical guidance, documentation, samples and on-site training to support your application needs.
Example Applications
Die Attach Adhesive Product Range
DELO MONOPOX AC Anisotropic Conductive Products
- Anisotropic electrically conductive
- Reliable electrical contacting
- Suitable for contact pads with narrow spacing
- Curing achieved through thermocompression
- Used for: ACA Die Attach, Conductive Adhesives & Shielding Materials (functional materials), etc.
Product AC268
Properties
28,000 Viscosity
Heat cured epoxy adhesive
Black / opaque
Anisotropic (z-axis) conductive epoxy for Flip Chip bonding, nickel-filled, fast curing (6s @ 190ºC) by thermode, excellent adhesion to FR4 & PET
Product AC2264
Properties
62,500 Viscosity
Heat cured epoxy adhesive
Grey / opaque
Anisotropic (z-axis) conductive epoxy for Flip Chip bonding, nickel-filled, fast curing (6s @ 190ºC) by thermode, excellent adhesion to FR4 & PET
Product AC2457
Properties
55,000 Viscosity
Heat cured epoxy adhesive
Grey / opaque
Anisotropic (z-axis) conductive epoxy for Flip Chip bonding, nickel-filled, fast curing (8s @ 180ºC) by thermode, excellent adhesion to FR4 & PET
Product AC6531
Properties
18,000 Viscosity
Heat cured epoxy adhesive
Grey / opaque
Anisotropic (z-axis) conductive epoxy for Flip Chip bonding, nickel-filled, fast curing (1.5s @ 200ºC / 100ms @ 350ºC) by thermode, excellent adhesion to FR4 & PET
Product AC6547
Properties
46,000 Viscosity
Heat cured epoxy adhesive
Grey / opaque
Anisotropic (z-axis) conductive epoxy for Flip Chip / BGA bonding, nickel-filled (d50 = 10µm), fast curing (9s @ 150ºC) by thermode, excellent adhesion to FR4 & PET
Product AC6568
Properties
95,000 Viscosity
Heat cured epoxy adhesive
Grey / opaque
Anisotropic (z-axis) conductive epoxy for Flip Chip bonding, nickel-filled, fast curing (1.5s @ 200ºC) by thermode, excellent adhesion to FR4 & PET
- DELO MONOPOX: Discover more about DELO MONOPOX and the full range of products.
DELO DUALBOND Miscellaneous Products
- General purpose adhesives
- B-stage products (BS) for MEMS applications
- Acrylate-based Dam & µDam materials
- Bonding of optical components
Product AD761
Properties
5,750 Viscosity
Light and / or Heat Cured Epoxy
Yellowish / transparent
Bonds to a wide range of materials
Product BS3770
Properties
115,000 Viscosity
Light-fixable & Heat Cured Epoxy
Beige / opaque
B-Stage adhesive, for MEMS die attach and lid seal, very low CTE of -57ºC
- DELO DUALBOND: Discover more about DELO DUALBOND and the full range of products.
DELO MONOPOX EG Electronic Grade Products
- Optimized for bonding in electronic components (Electronic Grade)
- Very low halogen content
- High cycle rates possible due to thermode curing
- Adjustable mechanics from stress-relieving to high-strength
- Used for: Reinforcement, Cap bonding / Lid attach, Camera Modules, etc.
Product EG2596
Properties
65,000 Viscosity
Heat cured epoxy adhesive (90°C minimum)
Red / fluorescent
High strength die attach adhesive for electronic applications
Product EG3739
Properties
10,000 Viscosity
Heat cured epoxy adhesive (100°C minimum)
Grey / opaque
High strength die attach adhesive for electronic applications
Product EG3773
Properties
60,000 Viscosity
Heat cured epoxy adhesive (130°C minimum)
Black / opaque
High strength die attach adhesive for electronic applications
- DELO MONOPOX: Discover more about DELO MONOPOX and the full range of products.
DELO DUALBOND IC Isotropic Conductive Products
- Isotropic electrically conductive
- Used for: Advanced packaging, medical electronics, automotive sensors, etc.
- Fast light fixation for short cycle times
- Optimized flow behavior
Product IC343
Properties
42,000 Viscosity
Light-fixable (optional) / Heat Cured Electrically Conductive mCD Epoxy
Silver grey
Low temperature (80C°) heat curing for shadow zones, meets ISO 10993-5 for cytotoxity
- DELO DUALBOND: Discover more about DELO DUALBOND and the full range of products.
DELO DUALBOND LT Low Temperature Products
- Low curing temperature (Low Temperature)
- Very low outgassing
- Fast light fixation for aligning components
- Reproducible curing shrinkage and low swelling
- Used for: Camera Modules
Product LT354
Properties
145,000 Viscosity
Light-fixable (optional) / Heat Cured Epoxy
Grey / opaque
Low-temperature (80°C) heat curing for shadow zones
Product LT2215
Properties
6,200 Viscosity
Light-fixable (optional) / Heat Cured Epoxy
Black / opaque
Low-temperature (60°C) heat curing for shadow zones
Product LT2266
Properties
53,500 Viscosity
Light-fixable (optional) / Heat Cured Epoxy
Black / opaque
Low-temperature (60°C) heat curing for shadow zones, meets ISO 10993-5 for cytotoxity
Product LT2267
Properties
55,000 Viscosity
Light-fixable (optional) / Heat Cured Epoxy
Whitish / opaque
Low-temperature (60°C) heat curing for shadow zones
- DELO DUALBOND: Discover more about DELO DUALBOND and the full range of products.
DELO DUALBOND OB Optical Bonding Products
- Optimised for optical bonding
- Mechanics adjustable from tension-compensating to high-strength
- Fast light fixation for the alignment of components
- Dimensionally stable, reproducble curing shrinkage and low swelling behavior
- No condensable outgassing
- Used for: Automotive camera, consumer camera, LED packaging, HDD, etc.
Product OB749
Properties
3,150 Viscosity
Light and / or Heat Cured Epoxy
Whitish / translucent
Complies with NASA outgassing requirements (ASTM E 595-93), low-temperature (80°C) heat curing for shadow zones, ideal for use in electronic applications
Product OB786
Properties
32,000 Viscosity
Light and / or Heat Cured Epoxy
Yellow / translucent
Complies with NASA outgassing requirements (ASTM E 595-93), meets ANSI/UL 94 HB flame test
Product OB787
Properties
46,800 Viscosity
Light and / or Heat Cured Epoxy
Yellowish / fluorescent
Low-temperature (80°C) heat curing for shadow zones, very low water absorption, bonds a very wide range of materials
Product OB6268
Properties
27,000 Viscosity
Light and / or Heat Cured Epoxy
Colourless (< 100µm layer thickness)/ transparent
Complies with NASA outgassing requirements (ASTM E 595-93)
Product OB6769
Properties
23,000 Viscosity
Light and / or Heat Cured Epoxy
Whitish / fluorescent
Complies with NASA outgassing requirements (ASTM E 595-93), meets ANSI/UL 94 HB flame test, meets ISO 10993-5 for cytotoxity & ISO 10993-10 for skin sensitisation
Product OB6786
Properties
32,500 Viscosity
Light and / or Heat Cured Epoxy
Black / opaque
Low-temperature (80°C) heat curing for shadow zones, meets ANSI/UL 94 HB flame test
Product OB6799
Properties
100,000 Viscosity
Light and / or Heat Cured Epoxy
Yellowish / opaque
Low-temperature (80°C) heat curing for shadow zones, complies with NASA outgassing requirements (ASTM E 595-93)
- DELO DUALBOND: Discover more about DELO DUALBOND and the full range of products.
DELO MONOPOX DA Die Attach Products
- Developed for chip bonding (Die Attach)
- High cycle rates possible through thermode curing
- Electrically insulating
- Mechanical properties adjustable from stress-relieving to high-strength
- Used for: Reinforcement, NCA Die Attach, etc.
Product DA255
Properties
33,000 Viscosity
Heat cured epoxy adhesive
Grey / opaque
Non-conductive die attach epoxy, ideal for bonding to gold, FR4 & LCP
Product DA587
Properties
31,000 Viscosity
Heat cured epoxy adhesive
White / opaque
Non-conductive die attach epoxy, ideal for bonding to silver, gold & FR4
Product TC2270
Properties
145,000 Viscosity
Heat cured epoxy adhesive (60°C minimum)
Grey / opaque
Thermally-conductive die attach epoxy, ideal for bonding to gold, FR4 & LCP, meets JEDEC MSL 1 requirments
- DELO MONOPOX: Discover more about DELO MONOPOX and the full range of products.
Knowledge Base Articles
Related Products
Further Information
Wiki – Integrated Circuit Packaging
Applications
Die Bonding, Glob-Top, Encapsulation, Dam & Fill, Z-Axis Bonding, Sealing, Potting, Protection Against Vibration, Conductive Electrical Connection
Industry Segments
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics, Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
DELO Website
Region
Available from Inseto in the United Kingdom & Ireland
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