Glob Top Encapsulants
Protecting bare silicon die is done in a variety of ways, by over-moulding in traditional semiconductor packaging, in metal hermetic packages, or by using glob top encapsulants on organic substrates. Depending on the die size, either a single-stage glob top is used or, for larger die, a two-stage process of damming the die with a high-viscosity adhesive and filling the enclosed space with a low-viscosity compatible adhesive.
What are Glob Top Encapsulants?
Encapsulation and glob top adhesives are liquid materials used to protect bare semiconductor die and wire bonds in microelectronic assemblies. They are dispensed over the die to form a protective barrier that shields sensitive components from mechanical damage, moisture, chemicals, and thermal stress.
For smaller die, a single‑stage glob top is typically used, while larger or more complex devices often use a two‑stage dam‑and‑fill encapsulation process for improved control and coverageGlass‑to‑metal and ceramic‑to‑metal sealing technologies are widely used where electronics must operate reliably in harsh environments, including high temperature, pressure, vibration, or chemically aggressive conditions.
Key Features of Glob Top Encapsulants
- High purity adhesives for bare die glob top encapsulation
- Glob-top and Dam & Fill adhesive materials
- Low CTE to prevent substrate warpage and breaking of wirebonds
- High Tg to minimise stresses, both during and after cure
- Excellent protection against mechanical stresses (temperature, vibration, etc.)
- Very high chemical resistance, e.g. automotive fluids, printing inks, etc.
- Option of heat-cured or UV-cured product ranges
- SVHC-Free Encapsulants GE6585, GE6525 & GE7065
DELO Heat-Cured Anhydride-Curing Epoxies
DELO’s family of heat-cured anhydride-curing epoxies offer significant advantages to the user:
- Dam heights of 3mm and above
- Simultaneous curing of Dam and Fill
- Fast curing times of 20 minutes at 150°C
- Optional low-temperature cure temperature at 100°C
- Operating temperature range from -65°C to +180°C
- Low CTE’s of < 25ppm for thermal mismatch compensation
- High Tg’s of approx. 180°C, with decomposition temperatures in excess of 320°C
- Excellent chemical and media resistance
- Compliance with JEDEC MSL 1 requirements
- Thermal shock resistance of > 1,000 cycles from -40°C to +150°C
- High purity with < 10ppm ionic impurities
- Low humidity sensitivity with < 0.1% water absorption
DELO UV-Cured Epoxies
In addition, DELO offers UV-cured epoxies for:
- Very fast curing (seconds)
- Short cycle times = high volume assembly
- Simultaneous curing of Dam & Fill
- Operating temperature range from -40°C to +150°C
- Excellent chemical and media resistance
- High purity with < 10ppm of Na+, K+, Cl– ions
NEW: Heat-cured high-reliability encapsulation materials currently contain small traces of Substances of Very High Concern (SVHC). This is allowed under current legislation, but that is likely to change in the not-too-distant future. DELO has developed a suite of new encapsulants, GE6585 (Dam), GE6525 (Fill) & GE7065 (GlobTop), that is totally SVHC-free. In addition, these encapsulants offer other advantages over existing materials: even lower CTE & higher Tg, lower curing temperatures and shorter cure times, and a wider operating temperature range.
Key Characteristics of Glob Top Encapsulants
- High‑purity, low‑ionic formulations designed for use in microelectronic assembly
- Designed to protect bare die and wire bonds from stress, moisture and exposure
- Suitable for single‑stage glob top and two‑stage dam‑and‑fill encapsulation
- Available with heat‑cure, light‑cure, or combined curing mechanisms
- Formulated to control flow and minimise stress on wire bonds and substrates during curing and operation
For useful information on choosing the right glob top adhesive for encapsulation, or help in understanding the terminology, and processing and technical guidelines, please look at our Knowledge Base Fact Sheet.
Got a Question About Glob Top Encapsulants?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right glob top encapsulant to optimising your processes, we provide technical guidance, documentation, samples and on-site training to support your application needs.
Example Applications
Encapsulation & Glob Top Adhesive Product Range
DELO MONOPOX GE General Encapsulant Products
- Optimized for encapsulation applications (General Encapsulant)
- Tailored coefficient of thermal expansion
- Excellent resistance to media
- Adjustable mechanical properties from stress-relieving to high-strength
- Used for: Encapsulation, Industrial Solutions, Encapsulation & Potting (functional materials)
Product GE6525
Properties
18,000 Viscosity
Fill for IC Encapsulation, one-part, heat-cured @ 100°C, black, high Tg, very low CTE (13ppm), wide operating temperature range (-65°C – 200°C), MESL1 & UL94 compliant, excellent flowing behaviour
Product GE6585
Properties
165,000 Viscosity
Dam for IC Encapsulation, one-part, heat-cured @ 100°C, black, high Tg, very low CTE (11ppm), wide operating temperature range (-65°C – 200°C), MESL1 & UL94 compliant
- DELO MONOPOX: Discover more about DELO MONOPOX and the full range of products.
DELO DUALBOND GE General Encapsulant Products
- Optimized for potting applications (General Encapsulant)
- Mechanics adjustable from tension-compensating to high-strength
- Optimized flow behavior
- Adjusted thermal coefficients of expansion
- Excellent media resistance
- Used for: Sensor potting, pin sealing, advanced packaging, etc.
Product GE7065
Properties
55,000 Viscosity
GlobTop for IC Encapsulation, light-fixable (optional) and heat-cured
Black
High Tg (218ºC), low CTE (19ppm), wide operating temperature range (-65ºC – 220ºC)
- DELO DUALBOND: Discover more about DELO DUALBOND and the full range of products.
DELO KATIOBOND Miscellaneous Products
- Adapted optical properties (refractive index, transmission)
- No yellowing or fading during aging
- Adjustable from flexible to hard
Product 4670
Properties
4,500 Viscosity
UV Cured
Grey / transparent
Fill for Dam & Fill System
Product DF698
Properties
160,000 Viscosity
UV Cured
Grey / transparent
Dam for Dam & Fill System
- DELO KATIOBOND: Discover more about DELO KATIOBOND and the full range of products.
Knowledge Base Articles
Related Products
Further Information
Wiki – Integrated Circuit Packaging
Applications
Die Bonding, Glob-Top, Encapsulation, Z-Axis Bonding, Sealing, Potting, Protection Against Vibration, Conductive Electrical Connection, Dam & Fill
Industry Segments
Microelectronic / Hybrid Assembly, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics, Photonic Assembly, Microwave Electronics, OEM Equipment Manufacturers, Precision Components & Assemblies, PCB Assembly, Electronic Component / Device Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics etc.
DELO Website
Region
Available from Inseto in the United Kingdom & Ireland
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