Inseto

Thick Film Silver Conductors

Koartan manufactures a comprehensive range of Gold, Silver, Palladium and Platinum conductive thick-film pastes for a wide variety of Microelectronic Hybrid applications.

Gold Thick Film Pastes Printed onto Ceramic Substrates

What are Thick Film Silver Conductors?

Thick film silver conductors are printable conductive pastes used to form electrical interconnects, terminations, and conductive features in thick film and hybrid microelectronic circuits.

Applied by screen printing onto ceramic or compatible substrates and subsequently fired, these materials create continuous silver‑based conductive paths that combine high electrical conductivity with cost‑effective processing.

Thick film silver conductors are widely used across power electronics, hybrid circuits, and multilayer ceramic assemblies.

Key Features of Silver Conductive Pastes

  • Suitable for all processes – etchable, solderable, etc.
  • Wide range of firing temperatures (450 – 1,050ºC)
  • Thinners available for extended working life (information on-demand)

Thick Film Conductive Pastes Resources

Koartan Thick Print Gold Paper – IMAPS2002

Thick Film Conductive Pastes

About Koartan Silver and Gold Pastes

Their range of Silver-bearing pastes includes conductor materials, termination metallisation’s, plateable inks, low-temperature firing from 400°C, and also lead- & cadmium-free products.

Koartan also offers combinations of Silver Palladium and Silver Platinum with a wide range of properties: high leach resistance, excellent solder acceptance, and some lead-free and cadmium-free materials.

Koartan Gold pastes are suitable for high conductivity thick film requirements, on both alumina and aluminium nitride. Included in the portfolio are both wire-bondable and solderable materials, as well as pastes for via plugging or edge coating. Wire-bondable and solderable Gold pastes are also available for low temperature firing applications, starting at 500°C, without any compromise in adhesion. Lead-free and cadmium-free options are also available.

Key Characteristics of Thick Film Silver Conductors

  • Silver offers very high electrical conductivity at a lower cost than noble metal alternatives, making it suitable for many interconnect and power applications.
  • Thick film silver conductors are screen printed and fired, forming durable conductive tracks bonded to the substrate.
  • These materials are commonly used where solderable surfaces are required for reliable component attachment.
  • Because silver can migrate in humid or biased environments, appropriate design measures are typically used to ensure long term reliability.
Microelectronic Thick Film AIN Pastes

Got a Question About Thick Film Silver Conductors?

Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.

From selecting the right thick film silver conductor to optimising your processes, we provide technical guidance, documentation, samples and on-site training to support your application needs.

Silver Thick Film Conductor Product Range

Part# 6101

Type

Via Fill

Description

Low shrinkage paste for filling large via holes in multilayer dielectrics, fires at 850ºC

Part# 6111

Type

Plateable

Description

General purpose, excellent line resolution, suitable for RF applications, fires at 850ºC

Part# 6120

Type

100% Ag

Description

Fine line, general purpose, inner multi-layer trace, fires at 850ºC

Part# 6122

Type

AIN Silver

Description

High adhesion silver conductor for aluminum nitride (AlN), fires at 850ºC

Part# 6125

Type

Low resistivity

Description

High solids content, thick printing for low resistivity applications, fires at 850ºC

Part# 6130

Type

Thru-hole

Description

Thin, highly conductive coating for the inside of holes and castellations, fires at 850ºC

Part# 6150

Type

Etchable

Description

High conductivity, 100% silver for etching fine lines, fires at 850ºC

Part# 6165

Type

High conductivity

Description

Low temperature firing, high electrical conductivity, fire at 500°C

Part# 6165-Sl

Type

Silicon silver

Description

Low temperature firing, for use on silicon substrates, high electrical conductivity, fires at 450°C

Part# 6166

Type

Solderable

Description

Low temperature, high conductivity, for resistor terminations, fires at 600°C

Part# 6540

Type

Substrate plug

Description

For plugging holes in alumina substrates, for two-sided circuits, fires at 850ºC

Part# 6550-1

Type

Etchable

Description

For very thin metalisation applications, multi-layer, fires at 850ºC

Knowledge Base Articles

Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.com

Wiki – Thick Film Technology

Thick Film Technology – Wikipedia

Applications

Microelectronic Devices, Microwave Devices, Heating Elements, Printable Resistors & Thermistors

Industry Segments

Microelectronic / Hybrid Assembly, Photonic Devices, Microwave Electronics, Automotive Electronics, Wireless Telecommunications, Data Processing, Instrumentation, Military, Consumer Electronics, Industrial Electronics

Region

Available throughout Europe from Inseto

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