Thin Film Circuits by ATP
Applied Thin-Film Products (ATP) is an ISO-9001 & AS-9100-certified manufacturer of high quality metalised thin film circuits. Using substrate material from blue-chip manufacturers, ATP transforms customer designs into finished product by using 100% in-house processes that ensure the highest quality. These processes include mask generation, sputtering and plating, laser drilling / resistor trimming, complete Via capability, Polyimide air bridges, and AuSn deposition.
ATP’s high quality thin film circuits are typically used on substrates such as As-Fired Alumina, Aluminium Nitride, Fused Silica / Quartz & Silicon, etc., with metalisations including TaN/TiW/Au & films including Ni, Pd & Ti. ATP offers highest quality products and quick turn-around times depending on customers’ specific requirements.
ATP is fully compliant with RoHS and REACH.
Explore the ATP Range of Thin Film Circuits
ATP – Introduction
A top-level look at ATP.
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ATP – Technology Overview
The technologies that ATP offers, including Vias and Polyimide bridges.
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ATP – Capabilities Overview
An introduction to ATP’s capabilities, such as ion beam and laser drilling.
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ATP – Components
Information on inductor coils, transmission lines, etc.
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ATP – Thin Film Design Guidelines
Details of the design guidelines developed by ATP.
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What are Thin Film Circuits?
Thin film circuits are precision microelectronic circuits formed by depositing extremely thin layers of conductive and resistive materials onto a stable substrate such as alumina, aluminium nitride, fused silica, quartz or silicon. These layers are applied using controlled thin film processes such as sputtering and plating, allowing highly accurate circuit geometries with excellent electrical and thermal performance.
Thin film circuits are commonly used in demanding applications including RF, microwave, photonics, aerospace and high reliability electronics, where performance consistency and miniaturisation are critical.
Key characteristics of thin film circuits include:
- High dimensional precision with deposition of fine conductors patterns
- Excellent thermal performance by using ceramic & other base substrates
- Wide choice of substrates & metallisations including Au, Ni, Pd, Ti & TiW
- Suitability for complex designs with integrated resistors, vias, double sided patterning and polyimide supported bridges
For guidance on the differences between thin and thick film circuits, please refer to our Knowledge Base fact sheet: What is the difference between Thin Film and Thick Film circuits.
Knowledge Base Articles
Further Information
Wiki – Thin Film
Thin Film Circuit Applications
Thin Film Substrates and Device, Metalised Blocks, Laser Diode Sub Mounts, Photodiode Mounts, Chip Mounts, Wire Bond Standoffs, Cooler Spacers, Ceramic Spacers, Microwave Metalized Circuits, RF Circuits, High Frequency Devices
Industry Segments
Military & Aerospace, Telecommunications, Fibre Optics, Photonics, Microwave Electronics, Microelectronics, Space & Research, General Power Electronics, Concentrated Photovoltaics (CPV), Military & Aerospace, Avionics, Automotive, Renewable Energy, Mass Transit etc.
ATP Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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