Device Assembly Equipment

Inseto supplies a comprehensive range of semiconductor assembly equipment to support device packaging and interconnection, from early‑stage development and process qualification through to pilot production and industrial manufacturing.

Our range includes high‑performance assembly tools from leading manufacturers, covering key back‑end process steps such as dicing, wafer bumping, laser processing, die attach, wire bonding, dispensing, solder reflow and sintering. These systems are used across a wide range of microelectronic, photonic and power device applications.

To support complete manufacturing flows, Inseto also supplies inspection, test and quality assurance equipment for assembled devices, enabling assessment of bond integrity, reliability and quality. In parallel, Inseto’s Materials Division provides compatible materials and consumable tooling.

Our dicing and scribing equipment supports wafer singulation and die separation, providing controlled and repeatable cutting of semiconductor wafers and other materials prior to assembly. Following singulation, wafer bumping and die attach systems enable accurate placement and bonding of bare die using a range of materials and processes, while wire and ribbon bonding equipment provides reliable electrical interconnection for both standard and high reliability applications.

Dispensing systems support the precise application of adhesives and encapsulants for die attach and package protection, whilst laser‑based processing and trimming systems plus vacuum reflow ovens and sintering systems complete the range of advanced packaging equipment.