Equipment Division

Inseto supplies advanced semiconductor equipment for research and production across the UK, Ireland, and Northern Europe. Our product range includes high-performance tools from leading global manufacturers, covering every stage from wafer fabrication to final device testing and quality assurance.

Wafer Fabrication Equipment

Inseto offers a comprehensive selection of wafer fabrication equipment designed to support every stage of semiconductor device production. Our wet benches are ideal for electroplating, etching, and cleaning processes. Lithography systems include imprint, exposure, cleaning, resist coating, and development tools to ensure precision patterning. We also offer furnaces for oxidation and annealing. We have wafer bonders for both temporary and permanent bonding. Additionally, we provide plasma ashing systems for effective surface preparation and cleaning.

Microelectronic Assembly & Packaging Equipment

Our assembly and packaging solutions are tailored to support advanced back-end semiconductor related processes. We provide wafer bumping tools, plus die bonders and wire bonders, available in both manual and automatic configurations. A range of dispensing systems are designed for precision die attach and encapsulation processes. Vacuum reflow ovens and Sintering presses are available for soldering and bonding.

Inspection, Test & Quality Assurance Equipment

Inseto’s inspection and test equipment ensures the quality and reliability of semiconductor devices. Our wafer probe stations enable accurate electrical testing, while scanning acoustic microscopes, X-ray systems and inspection microscopes, provide detailed internal imaging. Material testers support wire pull, bond shear, and die shear evaluations. We also offer advanced microscopes, laser trimming systems, precision hot plates, and contact angle measurement tools. For specialised applications, cryogenic equipment is available to support low-temperature testing environments.