The Prospector is now end-of-life.
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Further Information
Applications
Automated Semiconductor Defect Analysis & Process Characterisation, Wire Bond Pull Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Bond Shear Strength Checks, Bump Test, Cold-Pull Testing etc.
Industry Segments
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
Nordson-DAGE Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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