Micro Dispensing Systems – SL Series

The Kulicke and Soffa SL Series is an advanced micro dispensing system developed for high accuracy semiconductor packaging applications. The equipment is designed for processes such as narrow gap filling, fine line dispensing, and wafer level underfill, where precise material placement and stable motion control are critical.

With a compact machine footprint and support for up to 12 inch wafers, the SL Series is well suited to advanced packaging environments including system in package assembly, wafer level processes, and other microelectronics manufacturing applications.

Advanced Dispensing Technology

The SL Series is engineered to deliver consistent, repeatable micro dispensing performance for challenging micro scale applications. The platform is capable of precisely filling silver epoxy into gaps as small as 170 μm, as well as dispensing material volumes down to 0.2 nl along complex dispensing routes.

Motion Control and Accuracy

The SL Series is built on a rigid machine base and gantry structure designed to achieve high motion stability. The system delivers motion route repeatability of ±1 μm and positioning accuracy of ±2 μm, supporting tight process windows and reduced keep out zones.

This level of accuracy enables reliable dispensing in narrow gaps and fine geometries, helping to maintain yield and process consistency across production runs.

Advanced Vision and Software Control

The SL Series integrates advanced dispensing vision software with coordinated motion control to support accurate alignment and process stability.

Optional post dispensing automatic optical inspection is available for the SL Series. The integrated inspection system is designed to verify glue coverage and dispensing quality, supporting high detection accuracy for micro dispensing processes.

The system can be configured to support a range of handling options, including trays, magazines, wafer cassettes, and FOUP compatibility, enabling integration into different production workflows. These capabilities support both high mix development environments and volume production lines.

Typical Applications

The K&S SL Series is suitable for a wide range of advanced semiconductor and microelectronics applications, including wafer level underfill, system in package assembly, narrow gap silver epoxy dispensing, fine line and micro pattern dispensing and advanced semiconductor packaging processes.