Flip Chip Die Bonder
Key Features
- High Resolution Alignment Optics for Flip Chip Bonding <1 micron
- True Vertical Technology™, ensures die parallelism during bonding
- Die parallelism independent of Bond Height
- Quick to setup and change-over to different die types
- Flip Chip Stations & Alignment Systems fit on to all Tresky models
- Options for all processes: Heated tooling, ultrasonic, high force etc.
- Simple to learn and use
Tresky manufacture a range of manual and semiautomatic Flip Chip Bonder for die attach of bumped chips, or devices requiring high-precision, device-to-device alignment. Die can be picked from up to 200mm (8″) semiconductor wafers, waffle pack or GEL pak, in addition to passive components. Processes include Anisotropic (ACA) adhesives, gold bump thermosonic bonding, solder bump reflow etc.
For bump or device alignment, manual and semi-automatic systems incorporate the new Flip Chip Ultra, high resolution beam splitter optics, which allows the simultaneous viewing of two objects by an optical overlay. Using an optical shutter each of the objects (upper, lower or both) can then be displayed simultaneously on the monitor PC. The combination of high magnification optics, LED illumination and XY-Table Micro Positioning, result in alignment accuracies better than 1μm being achieved.
Additional features can include flip stations for applications that also require device inversion prior to placement, flux dip stations, integrated dispense, epoxy stamping, ultrasonic bond heads and eutectic heated stages etc. These options allow the systems to be configured for virtually any flip chip process/requirement.
Flip Chip Die Bonder Technical Downloads
File
Tresky Flip-Chip Ultra Brochure
Download
File
Tresky Flip Station Brochure
Download
File
Tresky Ultrasonic Brochure
Download
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Knowledge Base Articles
Description
Description
Adhesives for Die Attach (IKB071)
Link
Description
Die Attach Process: Guidance and Setup (IKB-072)
Link
Description
Understanding Shear Test: Ball Bond and Die Shear (IKB-018)
Link
Further Information
What is Flip Chip?
Flip chip is a semiconductor assembly technique in which a bare die is mounted face down directly onto a substrate, interposer or another device. Electrical and mechanical connections are formed through an array of bumps on the active surface of the die, rather than using fine wire bonded interconnects.
This face down configuration creates very short interconnect paths, enabling high connection density, improved electrical performance, and efficient heat transfer. The process requires accurate alignment and controlled bonding conditions to attach the die, and is widely used in advanced microelectronics, MEMS, optoelectronic devices, and high performance packaging applications.
Key characteristics of flip chip technology include:
- Face down die attachment using bumped interconnections
- High interconnect density with short electrical paths
- Improved electrical and thermal performance compared with wire bonding
- Requires high precision alignment and controlled bonding force
Inseto Knowledge Base Document:
Read our free guide to the “Die Attach Process: Guidance & Setup“
Wiki – Flip Chip
Applications
Flip Chip Die Attach, Thermosonic Die Bonding, High Precision Device Bonding, Stacked Die Bond, Multi-Chip-Module Assembly, Bio Medical Assembly, MEMS Device Interconnect
Industry Segments
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
Tresky Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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