Research and Development of MEMS Sensor Devices and Advanced Microelectronics

Specific Requirements:

SINTEF Digital – Smart Sensors and Microsystems, Oslo, Norway, required a highly precise and flexible die bonding solution to support its cutting-edge research in MEMS sensor devices, advanced microelectronics, Photonics and heterogeneous Packaging.

The system needed to handle diverse bonding processes, ensure repeatability, and accommodate delicate components without compromising accuracy.

Tresky AG Solution:

Inseto supplied and installed the Tresky T5300 die bonder, a semi-automatic system renowned for precision and adaptability in R&D environments. The configuration delivered to SINTEF included:

• Automated beam splitter and XY system for sub-micron placement accuracy and automated adhesive dispensing.
• High Force Module (up to 10 kg) for demanding bonding applications.
• Precision Kit for enhanced alignment and control.
• Stamping Kit for epoxy stamping processes.
• UV Curing Module enabling light fixation during placement for improved process stability.

This modular setup ensures SINTEF can perform a wide range of bonding techniques, including flip-chip, epoxy dispense/stamping, and eutectic bonding, all with Tresky’s True Vertical Technology™, guaranteeing parallelism between chip and substrate at any height.

Outcome:

The installation was completed successfully, and the system is now operational in SINTEF’s Smart Sensors and Microsystems lab. Early feedback indicates:

• Exceptional placement accuracy for MEMS and microelectronic components.
• Improved process repeatability, reducing operator-induced variation.
• Versatility to support multiple bonding methods for advanced R&D projects.

This investment positions SINTEF at the forefront of sensor and microelectronics innovation, enabling faster prototyping and reliable assembly for next-generation devices.

The T5300 was partly financed by The Research Council of Norway via the NorFab QT collaboration.