SRO-716 Vacuum Solder Reflow Batch Ovens

SRO-716 Key Features

Small Footprint, Freestanding Vacuum Reflow Oven
Touch TCs with Quick Swap Hotplates
Maximum Temperature 450°C, (optional 700°C)
Temperature ramp-up rate 3.5K/sec
Up to 100 process steps per profile recipe
Automatic Chamber Opening / Closing
Optional Top Heating
Heated Area: 314 x 314 mm
Oxygen < 1 ppm
Optional High-Pressure Atmosphere: up to 3 bar (abs)
Formic Acid, H2 or Solder Paste Activation

The ATV SRO-716 series standalone IR vacuum reflow ovens are the benchmark for R&D, low volume pilot line and medium volume batch production. The system produces high quality results with outstanding process stability and repeatability.

Configuration dependent, process capabilities include: flux-less soldering, eutectic die attach, gold tin soldering, void-free soldering, hermetic lid sealing, formic acid processing and flip chip soldering etc.

The oven is a small footprint standalone unit, only 760 mm wide x 1200 mm deep, thus saving cleanroom space compared to alternative systems.

Reflow profiles are created simply using ATV’s WIN-ATV software, which allows the user to program up to 100 process steps to create the ideal profile.

Products are then reflowed via IR lamps in the polished stainless steel cold-walled reflow chamber, in a controlled environment, resulting in excellent void free solder joints.