Wafer Fabrication Equipment

Inseto supplies a comprehensive range of wafer fabrication equipment to support semiconductor manufacturing, from early‑stage research and process development through to pilot production and industrial processing.

Our range includes high‑performance wafer fabrication tools from leading manufacturers, covering key front‑end process steps such as wafer cleaning, wet processing, deposition, lithography, thermal treatment, wafer bonding, plasma processing and metrology.

To complement front‑end fabrication, Inseto also supplies assembly, test and inspection equipment for advanced back‑end semiconductor processes, enabling customers to develop complete process flows from wafer through to finished device. In parallel, Inseto’s Wafers Division provides a comprehensive range of high‑quality wafers and substrates.

Our wet bench systems support electroplating, chemical etching and wafer cleaning processes, while lithography equipment includes tools for resist coating, exposure, development, imprint lithography and resist stripping to enable accurate and repeatable patterning.

Inseto also supplies thermal processing furnaces for oxidation and annealing, along with wafer bonding systems for both temporary and permanent bonding applications. In addition, our range of plasma ashing and surface treatment systems supports effective resist removal, surface preparation and contamination control.