Wafer Probing Equipment for Device Characterization

SemiProbe manufactures application specific wafer probing equipment for device characterization with the ability to make multiple types of measurements, in either manual, semiautomatic or fully automatic configurations. The systems are highly configurable for testing packaged parts, die, and small samples, through to 300mm wafers.

Options include thermal chucks for testing at elevated or cooled temperatures, shielding for light, thermal or measurement requirements. Systems can also be integrated with a wide range of third party equipment, whilst test instruments can be connected using probe cards and manual or programmable manipulators.

Full driver libraries are available for LabView, C++, and Visual Basic, with specific instrument drivers to support the most advanced instrumentation available. Communications may be made using RS-232, GPIB or TCP/IP, enabling the system to be either a controller or a slave in an integrated solution.

SemiProbe’s device characterization wafer probing equipment is configured using their patented Probe System for Life™ (PS4L) adaptive architecture. This modular concept enables seamless integration of advanced capabilities to deliver precise, accurate, repeatable measurements on even the most sophisticated semiconductor devices.