Semiautomatic Double Sided Optoelectronic Wafer Prober

Specific Requirements:

A university wanted a 150 mm semiautomatic, multi-purpose, double sided optoelectronic probing (DSP) system to test a variety of photonic devices using DSP carriers and standard chucks. They wanted the ability to test using conventional probing (topside down using a thermal chuck) or in a DSP mode where they had the option of probing from both sides (top and bottom) using carrier plates. They wanted to have options on where they mounted their detectors – in the front or on the sides.

SemiProbe Solution:

• SA-6 Semi-automatic 150 mm probe system:
  • Double-sided probing (DSP) capabilities
  • 150 mm programmable X, Y, Z and theta stage
  • PILOT Software Suite – Navigator, Wafer Map and Autoalign
• 150 mm thermal chuck system that operates from ambient to 200 C – locally and remotely and could hold die, partial wafers, and whole wafers up to 150 mm.
• DSP Carrier Plates and holders that would hold die, 75 mm, 100 mm, 150 mm wafers and thermal chuck.
• Topside Platen with coarse and fine platen lift
• Bottom Side Platen for manipulators, DSP camera and detectors
• Rigid Microscope Post with a 100 mm x 100 mm coaxial microscope movement and axis locking knobs
• Stereo Zoom optics that provided a large working distance (WD) and field of view (FOV).
• CCTV System – color camera and color monitor
• DSP adjustable Upwards Looking Camera System
• Three (3) Manual MA-9000 manipulators with magnetic bases. One is configured with an HF West/East probe arm with an adjustable optical fiber holder and the others are with triaxial probe arms
• Vibration Isolation Table with adjustable monitor/keyboard and mouse rack