uLAB Configurable Wet Bench Microfabrication Tool
PLATING and Pre- and Post-MODULES
- Customized modules for cleanroom microfabrication
- Spin coating, resist development and related wet processes
- HMDS primer, hot and cold plates
- Stainless steel or polypropylene housing materials.
- Automatic handling and ultra- and mega- sonic agitation options
- Internal chemical management
- Integration of laminar flow units
- Standard: Overflow Rinse
- Optional: Quick dump rinse (QDR), Spin rinse dry (SRD)
The configurable microfabrication unit μLab is an advanced wet bench processing tool enabling cleanroom processes for a range of industries, such as MEMS, semiconductor and microfluidics. μLab is the ideal equipment for industrial or R&D demands due to the flexible arrangement and customisable build-up of process capabilities. These systems are suitable for substrates, segments and wafer diameters up to 300 mm.
MOT can help to design and implement custom modules, automation solutions and other features to optimise the workflow and improve process outputs. MOT’s applications laboratory in Germany has all necessary tools to process and measure wafers, to provide the optimum in system configuration, performance and results.
The μLab enables you to specify the modules to be integrated from a variety of OEM partners with customisable modules such as spin coating of photoresists, heat treatment (both hot and cold plates), wafer level cleaning, post exposure photoresist development and other related wet processes.
A variety of general options are available alongside more customer specific configurations. These general options include Automatic and Semiautomatic Handling (Dry in – dry out); Integration of pre/post process cells, such as Etching and Spin Rinse Drying (SRD) modules; and Laminar Flow Units.
Technical Downloads
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μLAB Configurable Wet Bench Equipment Brochure
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Knowledge Base Articles
Description
Description
Introduction to Photoresist Coatings (IKB-086)
Link
Description
Photolithography Exposure Modes (IKB-053)
Link
Further Information
What are Configurable Chemical Wet Bench Systems?
Configurable chemical wet bench systems are modular wet process platforms designed to support a wide range of semiconductor microfabrication processes within a cleanroom environment. These systems allow users to select and integrate specific process modules, enabling tailored workflows for applications such as wafer cleaning, photoresist coating, development, etching and plating.
In semiconductor manufacturing and research, configurable wet benches provide flexibility to adapt equipment layouts to evolving process requirements. Typical configurations can include spin coating, hot and cold plates, resist processing, rinsing and drying modules, with options for automation, chemical management and laminar flow integration to support stable and repeatable processing.
Inseto Knowledge Base Document:
Read our guide to the “Semiconductor Photolithography Basics“
Wiki – Semiconductor Device Fabrication
Configurable Wet Bench Applications
Wafer and Substrate Cleaning, Coating, Etching, Plating, Via Fabrication, Porous Silicon Formation for MicroFluidic Devices, Power Semiconductors, MEMS Devices, Compound & GaN Materials, Photonic, Photovoltaic and LED Components etc.
Industry Segments
Semiconductor Wafer Fabrication, University Research and Development
MOT Mikro Website
Region
United Kingdom, Ireland, Finland, Sweden, Denmark, Estonia, Iceland & Norway
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