Gooch and Housego Installs Tresky T‑5300‑W for Advanced Photonic Die Attach

3rd March 2026

Inseto has successfully installed a Tresky T‑5300‑W Semi‑Automatic Die Bonder at Gooch and Housego’s Torquay facility, strengthening the company’s advanced photonic packaging capabilities.

The T‑5300‑W was selected to replace legacy manual equipment that could no longer meet increasing requirements for placement accuracy, process control, and throughput. The system provides sub‑micron placement accuracy and high repeatability, supporting a wide range of die attach processes including eutectic bonding, flip‑chip, epoxy dispense and stamping, UV curing, and die sorting.

Configured with wafer handling capability, precision alignment optics, heating options, and a second spindle for pre‑form handling, the Tresky platform offers the flexibility needed for both R&D and production environments. Tresky’s True Vertical Technology ensures consistent parallelism between die and substrate, delivering reliable bond quality across increasingly complex photonic assemblies.

The installation is now fully operational in Gooch and Housego’s production cleanroom and has already delivered improvements in accuracy, repeatability, and cycle time, supporting the company’s long‑term manufacturing strategy in high‑performance photonics.

A full case study for outlining installation is available here: https://www.inseto.com/equipment/manual-die-bonders-by-tresky-ag/tresky-t-5300-semiautomatic-die-bonder/gh-installs-tresky-t-5300-w-for-advanced-photonic-die-attach/