MIL STD 883 Shear Testing
Explanation of the MIL STD 883 shear testing; describing the type of failure resulting from this application of force (if failure occurs); and the visual appearance of the residual die attach media and substrate/header metallization (IKB-026).
Shear Strength:
A force sufficient to shear the die from its mounting or equal to twice the minimum specified shear strength (figure 2019-4), whichever occurs first, shall be applied to the die.
Testing Methods:
See IKB018 UNDERSTANDING BALL BOND AND DIE SHEAR TESTING for an explanation of how shear testing works, and the main points to take note of when shear testing.
Failure Criteria:
A device which fails any of the following criteria shall constitute a failure:
- Fails die strength requirements (1.0X) of figure 2019-4.
- Separation with less than 1.25 times the minimum strength (1.0X) specified in figure 2019-4 and evidence of less than 50 percent adhesion of the die attach medium.
- Separation with less than 2.0 times the minimum strength (1.0X) specified in figure 2019-4 and evidence of less than 10 percent of adhesion of the die attach medium.
NOTE: For eutectic die attach, residual silicon attached in discrete areas of the die attach medium shall be considered as evidence of such adhesion. For metalised glass die attach, die attach material on the die and on the package base shall be considered as evidence of acceptable adhesion.
Separation Categories:
When specified, the force required to achieve separation and the category of the separation shall be recorded:
- a. Shearing of die with residual silicon remaining.
- b. Separation of die from die attach medium.
- c. Separation of die and die attach medium from package.
SUMMARY:
The following details shall be specified:
- a. Minimum die attach strength if other than shown on figure 2019-4.
- b. Number of devices to be tested and the acceptance criteria.
- c. Requirement for data recording, when applicable (see 3.2.1).
NOTES:
- All die area larger than 64 x 10-4 (IN)2 shall withstand a minimum force of 2.5 kg or a multiple thereof (see Failure Criteria section above).
- All die area smaller than 5 x 10-4 (IN)2 shall withstand a minimum force (1.0X) of 0.04 kg/10-4 (IN)2 or a minimum force (2X) of 0.08 kg/10-4 (IN)2. FIGURE 2019-4. Die shear strength criteria (minimum force versus die attach area).
Ref: MIL-STD-883E METHOD 2019.5 29 May 1987 1 METHOD 2019.5 DIE SHEAR STRENGTH
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Author
Date
Version
Author
Matt Houston
Date
03 July 2017
Version
IKB026 Rev. 1
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Author Biography
Matt Houston is a Sales Engineer at Inseto with over 16 years of experience in the microelectronics and semiconductor industry. His background spans process engineering, technical support and technical sales.
He began his career as a Process Engineer at C‑MAC in Great Yarmouth, working on die bonding and wire bonding for high‑reliability, high‑temperature electronic components, opto‑electronics and multi‑chip modules.
At Inseto, Matt has developed broad hands on experience across a range of semiconductor equipment through installations, training and process support. This enables him to support customers in selecting tailored solutions that meet specific technical requirements.
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