Adjusting Bond Force Settings on Manual MPP and K&S Wire Bonders
Adjusting Bond Force Settings: The adjustment of the process bond force parameters for 1st and 2nd bonds on MPP iBond Series Manual Wire Bonders and Kulicke & Soffa “legacy” 4500 Series Wire Bonders (IKB-009).
- During the bonding cycle, the bond force is applied while ultrasonic energy is been applied to the wedge/capillary. The static bond force is a combination of the Static Bond force and also additional bond force applied from the Force coil.
45xx Series:
- The Force coil is controlled via the 1st Bond and 2nd Bond potentiometer dials on the left hand side front panel:
iBond5000 Series:
- The Force coil is controlled via 1st and 2nd Bond Force adjustment on the touch screen panel:
To adjust the Bond Force:
- Ensure the Bonder is in Reset Position; confirm this by ensuring the ‘1st Bond LED’ is illuminated (4500 series) or ‘Reset Position’ is displayed in the status window (iBond series).
- The ‘Set Up/Reset’ switch located on the right hand side panel (4500 series) or ‘Setup’ slider within the iBond5000 menu section (iBond series) are showing SETUP.
- With the bonder in SETUP the machine will drive the Force Coil constantly at both 1st and 2nd bond forces depending on the machine cycle position.
- Set both 1st and 2nd Search adjustment to zero.
- Press and hold the ‘Semi/Auto Chessman button’. The bond head will move into the ‘1st Search height’.
- Using a suitably scaled gram gauge lift the bond head under the wedge/capillary. As the bond head starts to rise, read the value on the gram gauge.
- This measured value is the bond force for the 1st Bond; adjust the ‘1st Bond Force adjustment’ until a desired force is measured on the gram gauge.
- Release the ‘Semi/Auto Chessman button’, the bond head will move to the ‘Loop Height’.
- Press and hold the ‘Semi/Auto Chessman button’. The bond head will move into the ‘2st Search height’. Again, lift the bond head with the gram gauge under the wedge/capillary until the bond head starts to rise.
- This measured value is the bond force for the 2nd Bond; adjust the ‘2nd Bond Force adjustment’ until a desired force is measured on the gram gauge.
- Release the ‘Semi/Auto Chessman button’, the bond head will move to the ‘Reset Height’.
- Return the ‘Set Up/Reset’ switch to the mid position.
View the range of “MPP Equipment for Wire Bonding” (formerly KnS manual wire bonders).
Author
Date
Version
Author
Adam Marshall
Date
02 June 2017
Version
IKB009 Rev. 3
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Author Biography
Adam Marshall is a Senior Technical Support Engineer at Inseto Ltd with over 14 years of experience in the semiconductor industry, including 10 years specialising in assembly processes and related equipment. He supports customers across the microelectronics and semiconductor sectors who rely on precision equipment to maintain reliable and repeatable results in production and research environments.
Known for a calm and structured approach, Adam works closely with customers, suppliers and internal teams to deliver clear technical advice and dependable support when it matters.
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