PacTech Showcases Laser Based Assembly Technologies

13th April 2026

At MicroTech 2026, PacTech presented the latest developments in laser based assembly technologies, highlighting how these processes are enabling advanced semiconductor packaging and heterogeneous integration across both fine pitch and large scale applications.

The presentation focused on laser solder ball placement and jetting, a flux free, contactless process capable of placing and reflowing solder balls from 40 µm to 2500 µm. Using highly localised, selective laser heating with millisecond scale reflow, the process significantly reduces thermal stress on sensitive devices, limits intermetallic growth, and delivers excellent process control for fine pitch interconnects. Typical applications include via filling, solder stacking, selective rework, and complex 2D and 3D packaging architectures.

PacTech also introduced its LAPLACE laser assisted bonding and reflow technology. This approach uses modulated laser beams combined with optical temperature monitoring to achieve fast, controlled reflow exclusively at the bonding interface. By avoiding bulk heating, LAPLACE supports high placement accuracy, reduces package warpage, and enables reliable bonding of dissimilar materials with high CTE mismatch, an increasingly critical requirement for heterogeneous integration.

Together, these laser based assembly technologies address demanding requirements across photonics, power semiconductor devices, sensors, and multi die systems. The presentation demonstrated how precision laser processes can deliver the flexibility, accuracy, and long term reliability required for next generation semiconductor packaging.

Inseto works closely with PacTech to support customers across the UK and Ireland with advanced assembly solutions. To find out how laser soldering, bonding, and reflow technologies can support your advanced packaging or heterogeneous integration challenges, please contact the Inseto team.