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SOI Wafer W-SOI 06/006

Code
W-SOI 06/006 Category:
Wafer Diameter
150mm
Material
SOI
Type
P
Crystallographic Orientation
100
Device Thickness
33 um
Growth Method
CZ
Device Resistivity
0.01 - 0.02 Ohm.Cm
BOx
1
Handle Thickness
550 um
Growth Method
CZ
Handle Resistivity
0.005 Ohm.Cm
Backside
DSP
Other

£TBC

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