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SOI Wafer W-SOI 06/007

Code
W-SOI 06/007 Category:
Wafer Diameter
150mm
Material
SOI
Type
N
Crystallographic Orientation
100
Device Thickness
20 um
Growth Method
CZ
Device Resistivity
0.008 - 0.02 Ohm.Cm
BOx
3
Handle Thickness
627 um
Growth Method
CZ
Handle Resistivity
0.008 - 0.025 Ohm.Cm
Backside
DSP
Other

£TBC

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