Test & Inspection Equipment

Inseto supplies a comprehensive range of inspection, test and metrology equipment to support semiconductor manufacturing, from early‑stage process development through to in‑line production monitoring and final device qualification.

The range includes high‑performance inspection and measurement systems from leading manufacturers, covering key process stages across both front‑end and back‑end manufacturing. These systems support wafer‑level inspection, packaged device inspection and electrical test, helping manufacturers identify defects, monitor process stability and ensure consistent product quality.

To complement fabrication and assembly workflows, Inseto provides wafer probe stations for accurate electrical characterisation, alongside optical inspection systems and advanced microscopes for surface and structural analysis. Scanning acoustic microscopy and X‑ray inspection systems enable non‑destructive internal inspection of assembled devices, supporting the detection of voids, delamination and interconnect defects.

Inseto also supplies material and bond test equipment for wire pull, bond shear and die shear testing, allowing quantitative assessment of interconnect strength and assembly reliability. These tools are widely used in process development, quality assurance and failure analysis environments.

Across all inspection and metrology applications, Inseto’s technical specialists offer expert application support to help customers select the most appropriate inspection and test equipment for their process requirements, whether for research, pilot lines or volume production.