DELO Adhesive Curing Methods
Inseto is the exclusive UK and Ireland distributor for DELO Industrial Adhesives, offering a full range of curing methods engineered to match specific manufacturing, assembly and production requirements. DELO adhesive curing methods span UV and visible light, heat, dual cure, moisture, anaerobic exposure and two component systems, each formulated to meet demanding process requirements including precise fixture times, shadow area coverage, chemical resistance and long-term mechanical durability.
Inseto supports the full range of DELO curing methods with technical expertise, application testing and process development, helping manufacturers select a curing process suited to their substrates, component geometries and production conditions.
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Which Adhesive Curing Methods Do We Offer?
- UV Light Curing: cures within seconds under UV exposure, built for applications requiring extremely fast processing times and high throughput production lines.
- Visible Light Curing: cures using visible light rather than UV, enabling processing where UV exposure is restricted, including on UV-blocking materials.
- Light Activated: pre-activated using visible light during dispensing, allowing cure initiation to begin while parts are positioned.
- Dual Curing: combines light curing with a secondary heat or moisture cure mechanism, formulated for assemblies with shadow zones or complex geometries.
- Anaerobic Curing: cures in the absence of oxygen when in contact with metal ions, developed specifically for magnet bonding and thread locking applications.
- Moisture Curing: high purity silicone-based materials that cure through ambient moisture exposure, suited to sealing and potting applications requiring long-term flexibility.
- Heat Curing: one-part materials with long shelf life at room temperature, activated by elevated temperature to deliver high strength and durable bonds for demanding applications.
- Two Component: A and B systems mixed prior to application, enabling rapid assembly and cure without light or heat input.
To explore individual curing technologies in more detail, please select the relevant material family, for example DELO KATIOBOND, or click on the curing method icons below to view adhesives matched to specific curing processes.
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Explore the DELO Adhesives Product Range by Curing Method
Get Expert Advice on Adhesive Curing Methods
Need help selecting the right curing method, chemistry or cure profile for your application? Our specialists can support material selection, process development and help match the right DELO adhesive to your production line. Visit our Knowledge Base for technical guides and application notes, or contact us directly for free technical advice:
enquiries@inseto.com or call: +44 1264 334505
Further Information on Adhesives
Inseto Adhesive Division Product Overview
Wiki – Adhesive Description
FAQs
How do I choose the right adhesive curing method for my application?
The right curing method depends on your substrate, joint design, line speed and whether light can reach every part of the bond line. Assemblies with shadow zones often need dual curing, while high volume lines with open access typically suit UV or visible light curing. Inseto’s technical team can review your application and recommend a suitable DELO adhesive and cure process.
What is the difference between UV curing and visible light curing?
UV curing uses ultraviolet light to trigger a fast cure, often within seconds, and works well on high throughput lines. Visible light curing uses light outside the UV spectrum, making it suitable for substrates or coatings that block UV wavelengths, such as tinted glass or certain plastics.
Can DELO adhesives cure in shadowed or hard to reach areas?
Yes. DELO dual curing adhesives combine a light cure with a secondary heat or moisture cure, allowing the adhesive to reach shadowed sections of a joint that light alone cannot access. This makes dual curing a common choice for complex assemblies and multi-part geometries.
Further Information
Applications
Bonding, Glob-Top, Encapsulation, Z-Axis Bonding, Sealing, Potting, Under-fill, Protection Against Vibration, Conductive Electrical Connection, Dam & Fill, Securing, High Strength Mechanical Joining (Can Replace Soldering or Rivets), Casting, Potting, Gap Filling etc.
Industry Segments
Electronics, Microelectronics, Semiconductor, Automotive, Energy, Aerospace, Medical, Engineering, Plastics, Glass, Consumer Devices etc.
DELO Website
Region
United Kingdom and Ireland
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