Laser Processing Equipment by Photonic Systems Group
Photonics Systems Group (PSG) develops and manufactures high‑precision laser processing systems for electronics, semiconductor and photovoltaic manufacturing, where precision and reliability are critical. The group’s equipment is designed for applications requiring controlled, repeatable laser micromachining of complex materials, supporting both research and high‑volume production environments.
PSG’s laser systems are built on modular platforms that can be configured for stand‑alone operation or integrated inline within production lines. Systems support a range of laser sources, motion platforms and automation options, allowing equipment to be tailored to specific materials, geometries and throughput requirements.
Laser Trimming Systems
PSG’s laser trimming systems are used to fine‑tune thick and thin film electrical components and circuits by controlled laser material removal with real‑time electrical measurement. These systems support both active and passive trimming of resistors, sensors and hybrid circuits, enabling tight tolerance control after manufacture.
Wafer Trimming and Wafer‑level Processing
Laser wafer trimming systems from Photonics Systems Group support precision trimming and structuring at wafer level for semiconductor and power electronics applications. Laser processing enables µm‑level accuracy while maintaining process stability and throughput.
PCB Depaneling, Routing and Drilling
PSG provides laser systems for precise processing of printed circuit boards, including depaneling, routing, drilling and structuring. Laser processing enables clean separation and feature definition without mechanical stress, supporting rigid, flex and rigid‑flex PCB materials.
Ceramic Processing Systems
Photonics Systems Group laser systems for ceramic processing are designed for cutting, drilling and scribing high‑performance ceramic materials such as alumina and aluminium nitride. The use of ultrashort pulse lasers enables minimal thermal impact, improved edge quality and controlled fracture behaviour.
Thick Film Laser Trim
Thick film laser trimmer provides precise post trimming adjustment of resistors, sensors and hybrid circuits.
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Wafer Laser Trimmer
Wafer level circuit trimming and matching, Power electronics wafer processing.
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PCB Laser Depanneling
Precise and fast laser depaneling of rigid and flexible printed circuit boards.
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Ceramic Laser Machining
Lasertool for cutting, drilling and scribing high‑performance ceramic materials.
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Further Information
What is the benefits of Lasers vs Traditional Processes
Laser based processes offer higher precision and repeatability than traditional mechanical methods, making them well suited to fine pitch electronics and delicate materials. As a non contact process, lasers eliminate tool wear and reduce mechanical stress on sensitive substrates. Energy is applied very locally, resulting in smaller heat affected zones and improved material integrity.
Laser systems are also software controlled, allowing rapid changeover between designs without tooling, while clean processing often removes the need for secondary finishing steps.
Wiki – Laser Beam Machining
Laser Equipment Applications
Thick and Thin Film Circuit Production, Wafer Fabrication, Ceramic Component Processing
Industry Segments
Semiconductor Wafer Fabrication, PCB Assembly and Production, Microelectronics, Electronics, Optical, Photonics, Engineering, Medical Devices, Automotive, Aerospace and High Reliability Components
PSG Website
Region
Available from Inseto in the United Kingdom, Ireland, Finland, Norway & Sweden.
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