DELO MONOPOX One-Part Heat Cured Epoxy Adhesives
DELO MONOPOX one-part heat-cured epoxy adhesives are supplied ready to use with no mixing required. Curing takes place in 15 to 75 minutes at temperatures between 60°C and 180°C. Grades are available with excellent flow properties or high run-off resistance for vertical and complex assemblies.
What is DELO MONOPOX?
DELO MONOPOX is a range of one-part heat-cured epoxy adhesives designed for bonding, casting and sealing in electronics, automotive and industrial manufacturing applications.
These epoxy resin adhesives are high-strength materials supplied pre-mixed and ready to dispense. They are used as direct alternatives to riveting, welding and brazing in applications where stress reduction, weight saving and process reliability matter.
Examples of solved applications using DELO MONOPOX heat cured epoxies can be found here.
Key Features of DELO MONOPOX Heat Cured Epoxy Adhesives
- One-part epoxy adhesive, supplied ready to use with no mixing required
- Heat curing from as low as 60°C
- Curing in 15 to 75 minutes depending on grade and process
- Excellent adhesion to metals, ferrites, ceramics and engineering plastics
- Electrically conductive and non-conductive grades available
- Excellent resistance to heat, chemicals and moisture
- Low ionic content grades for sensitive electronics applications
Advantages of Heat Cured Epoxy Adhesives
When assemblies face thermal cycling, chemical exposure or mechanical stress, the wrong adhesive fails quietly and often expensively. DELO MONOPOX grades are built for exactly these conditions.
Additional benefits include:
- Low water absorption, reducing the risk of degradation over time
- Protection against corrosion on bonded metal substrates
- Reduced stress concentrations compared with mechanical fastening
- Support for miniaturisation and lightweight assembly design
For manufacturers in electronics, automotive and industrial sectors, these properties help maintain reliable performance across extended production runs.
High Strength Epoxy Adhesives for Electronics Manufacturing and Semiconductor Packaging
DELO MONOPOX adhesives are specified across some of the most demanding production environments in electronics, automotive and industrial manufacturing. The common factor is not the application, it is the requirement for an adhesive that performs without variation across thousands of production cycles.
Their low ionic content and strong adhesion to electronic substrates make them well suited to die attach, flip chip bonding, RFID assembly and sensor bonding applications exposed to thermal cycling.
For encapsulation and potting of sensitive components, the materials offer controlled thermal expansion and proven resistance to heat, vibration and moisture ingress.
In automotive and EV battery applications, DELO MONOPOX adhesives provide the structural strength and thermal stability required in demanding production environments.
How Heat Cured Epoxy Adhesives Work in Automated Production
Manufacturers use heat cured epoxy adhesives when they need a one-part system that stays stable at room temperature, dispenses consistently in automated lines and cures on demand under controlled heat.
Unlike two-part systems, there is no mixing required. The resin and curing agent are pre-mixed at manufacture, activated only when the assembly reaches the target temperature. This makes them well suited to high-volume production where repeatability and process control matter.
Fast-cure grades can reach full strength in as little as 15 minutes, making them well suited to high-speed thermode curing in electronics assembly lines. Slower cure profiles operating at lower temperatures suit batch oven processes where multiple components cure together. The cured bond forms a rigid, crosslinked structure with strong resistance to heat, chemicals, vibration and moisture.
Key characteristics include:
- Single-component processing, supplied ready for use with no mixing required
- Thermally activated curing, typically from 60°C upwards
- High structural performance with excellent mechanical strength
- Proven resistance to heat, chemicals, moisture and corrosion in demanding environments
Got a Question About Heat Cured Epoxy Adhesives?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right heat cured epoxy adhesive to optimising your curing process, we provide technical guidance, documentation, and samples to support your application needs.
Example Applications Using Heat Cured Epoxy Adhesives
DELO MONOPOX Heat Cured Epoxy Product Range
DELO MONOPOX EG Electronic Grade Products
- Optimized for bonding in electronic components (Electronic Grade)
- Very low halogen content
- High cycle rates possible due to thermode curing
- Adjustable mechanics from stress-relieving to high-strength
- Used for: Reinforcement, Cap bonding / Lid attach, Camera Modules, etc.
Product EG2596
Properties
65,000 Viscosity
Heat cured epoxy adhesive (90°C minimum)
Red / fluorescent
High strength die attach adhesive for electronic applications
Product EG3739
Properties
10,000 Viscosity
Heat cured epoxy adhesive (100°C minimum)
Grey / opaque
Very low Tg (-55ºC), ideal for MEMS die attach applications
Product EG3773
Properties
60,000 Viscosity
Heat cured epoxy adhesive (130°C minimum)
Black / opaque
Very low Tg (-65ºC), ideal for MEMS die attach applications
DELO MONOPOX DA Die Attach Products
- Developed for chip bonding (Die Attach)
- High cycle rates possible through thermode curing
- Electrically insulating
- Mechanical properties adjustable from stress-relieving to high-strength
- Used for: Reinforcement, NCA Die Attach, etc.
Product DA255
Properties
33,000 Viscosity
Heat cured epoxy adhesive (120°C minimum)
Grey / opaque
Non-conductive die attach epoxy, ideal for bonding to LCP, gold & FR4, very fast cure at 180ºC in 6 seconds
Product DA587
Properties
31,000 Viscosity
Heat cured epoxy adhesive (110°C minimum)
White / opaque
Non-conductive die attach epoxy, ideal for bonding to gold, silver & FR4
Product DA2258
Properties
42,000 Viscosity
Heat cured epoxy adhesive (60°C minimum)
Black / opaque
Non-conductive die attach epoxy, ideal for bonding to gold, nickel, FR4 & LCP
Product TC2270
Properties
145,000 Viscosity
Heat cured epoxy adhesive (60°C minimum)
Grey / opaque
Thermally-conductive die attach epoxy, ideal for bonding to gold, FR4 & LCP, meets JEDEC MSL 1 requirments
DELO MONOPOX AC Anisotropic Conductive Products
- Anisotropic electrically conductive
- Reliable electrical contacting
- Suitable for contact pads with narrow spacing
- Curing achieved through thermocompression
- Used for: ACA Die Attach, Conductive Adhesives & Shielding Materials (functional materials), etc.
Product AC268
Properties
28,000 Viscosity
Heat cured epoxy adhesive
Black / opaque
Anisotropic (z-axis) conductive epoxy for Flip Chip bonding, nickel-filled, fast curing (6s @ 190ºC) by thermode, excellent adhesion to FR4 & PET
Product AC2264
Properties
62,500 Viscosity
Heat cured epoxy adhesive
Grey / opaque
Anisotropic (z-axis) conductive epoxy for Flip Chip bonding, nickel-filled, fast curing (9s @ 150ºC) by thermode, excellent adhesion to FR4 & PET
Product AC2457
Properties
55,000 Viscosity
Heat cured epoxy adhesive
Grey / opaque
Anisotropic (z-axis) conductive epoxy for Flip Chip bonding, nickel-filled, fast curing (8s @ 180ºC) by thermode, excellent adhesion to FR4 & PET
Product AC6531
Properties
18,000 Viscosity
Heat cured epoxy adhesive
Grey / opaque
Anisotropic (z-axis) conductive epoxy for Flip Chip bonding, nickel-filled, fast curing (1.5s @ 200ºC / 100ms @ 350ºC) by thermode, excellent adhesion to FR4 & PET
Product AC6547
Properties
46,000 Viscosity
Heat cured epoxy adhesive
Grey / opaque
Anisotropic (z-axis) conductive epoxy for Flip Chip bonding, nickel-filled, fast curing (1.5s @ 200ºC) by thermode, excellent adhesion to FR4 & PET
Product AC6568
Properties
95,000 Viscosity
Heat cured epoxy adhesive
Grey / opaque
Anisotropic (z-axis) conductive epoxy for Flip Chip bonding, nickel-filled, fast curing (1.5s @ 200ºC) by thermode, excellent adhesion to FR4 & PET
DELO MONOPOX GE General Encapsulant Products
- Optimized for encapsulation applications (General Encapsulant)
- Tailored coefficient of thermal expansion
- Excellent resistance to media
- Adjustable mechanical properties from stress-relieving to high-strength
- Used for: Encapsulation, Industrial Solutions, Encapsulation & Potting (functional materials)
Product GE6515
Properties
10,000 Viscosity
Heat cured epoxy adhesive
White / opaque
IC encapsulation adhesive, high Tg of 155ºC, low CTE of 23ppm/ºK, extended operating temperature of 200ºC
DELO MONOPOX CU Capillary Underfill Products
- Fills the gap between package (BGA, Flip Chip, CSP) and substrate
- Excellent reinforced mechanical strength
- Fast curing adhesives
- Low temperature cure options
- 3 day processing time
Product CU2955
Properties
20,000 Viscosity
Heat cured epoxy adhesive
Blue / green
Underfill adhesive for BGA support, high Tg & low CTE
Product CU6514
Properties
1,400 Viscosity
Heat cured epoxy adhesive
Black
Underfill adhesive for Flip Chip support, very small particle size
DELO MONOPOX LT Low Temperature Products
- Low curing temperature
- Rapid light fixation for the alignment of components
- Consistent cure shrinkage and low swelling
- Very low outgassing
Product LT204
Properties
28,000 Viscosity
Heat cured epoxy adhesive (60°C minimum)
Black
Bonds to a wide range of materials, including nickel, LCP, FR4 and aluminium
Product LT3757
Properties
85,000 Viscosity
Heat cured epoxy adhesive (80°C minimum)
Grey / fluorescent
Very low Tg (-34ºC), good bond strength to nickel & LCP, meets ISO 10993-5 for cytotoxity
DELO MONOPOX HT High Temperature Products
- Developed for high-temperature applications
- Optimized for structural bonding with high strength
- High temperature resistance and high chemical resistance
- Used for: (New) Electric Vehicle, Structural bonding (functional materials), etc.
Product HT2860
Properties
110,000 Viscosity
Heat cured epoxy adhesive (130°C minimum)
Grey / opaque
Very high bonding strength, extended pot life, wide operating temperature range (-55°C – 220°C), passes ANSI/UL 94 HB flame test
Product HT2999
Properties
400,000 Viscosity
Heat cured epoxy adhesive (130°C minimum)
Grey / opaque
Very high bonding strength, extended pot life, wide operating temperature range (-55°C – 220°C), low CTE of 30ppm/°K, high Tg (180°C)
DELO MONOPOX Miscellaneous Products
- Optimized for structural joining
- High temperature resistance and high chemical resistance
- Easy handling in terms of storage and processing
- Robust universal adhesion strength
- Used for: (New) Electric Vehicle, Industrial Solutions, Structural bonding (functional materials), etc.
Product AD286
Properties
140,000 Viscosity
Heat cured epoxy adhesive (130°C minimum)
Silver-grey / opaque
Extended pot life, very high bonding strength, wide operating temperature range (-55°C – 200°C), meets ANSI/UL 94 HB flame test
Product AD295
Properties
1920,500 Viscosity
Heat cured epoxy adhesive (150°C minimum)
Beige / opaque
Extended pot life, very high bonding strength, wide operating temperature range (-40°C – 200°C), meets ANSI/UL 94 HB flame test
Product SJ2981
Properties
360,000 Viscosity
Heat cured epoxy adhesive (130°C minimum)
Beige / opaque
Extended pot life, very high bonding strength, wide operating temperature range (-55°C – 200°C)
Knowledge Base Articles
Description
Description
Basic Adhesive Types (IKB-041)
Link
Description
How to Choose the Right Adhesive (IKB-035)
Link
Description
All Things Considered (IKB-042)
Link
Description
Encapsulation Adhesives (IKB-013)
Link
Description
Likely Changes To Chip Encapsulation Adhesives (IKB-079)
Link
Description
Adhesives for Die Attach (IKB-071)
Link
Description
Die Attach Process: Guidance and Setup (IKB-072)
Link
Description
Explanation of Low Pressure Plasma Cleaning (IKB-014)
Link
Related Products
FAQs
Where can I buy DELO MONOPOX heat cured epoxy adhesives in the UK?
Inseto is the authorised distributor for the full DELO MONOPOX range across the UK and Ireland. Call +44 (0)1264 334505 or use the enquiry form on this page to request a sample, datasheet or quote.
What temperature do DELO MONOPOX adhesives cure at?
Cure temperatures range from 60°C to 180°C depending on the grade and application. Some grades support rapid thermode curing, while others use longer oven cure profiles. Inseto can recommend the correct cure schedule for your production process.
Do one-part heat cured epoxy adhesives require mixing?
No. One-part epoxy adhesives are supplied pre-mixed and ready to dispense. This removes manual mixing steps and reduces the risk of dispensing errors in automated production environments.
What materials do DELO MONOPOX adhesives bond to?
DELO MONOPOX adhesives bond to metals, ferrites, ceramics, glass and many engineering plastics. Inseto can advise on substrate compatibility and surface preparation for your specific application.
Are conductive epoxy adhesive grades available?
Yes. Electrically conductive and thermally conductive grades are available for electronics, semiconductor packaging and EV battery applications.
Can heat cured epoxy adhesives replace welding or riveting?
In many electronics and lightweight industrial assemblies, yes. Heat cured epoxy adhesives reduce stress concentrations, support miniaturisation and can remove the need for mechanical fastening in suitable applications.
Is DELO MONOPOX suitable for semiconductor packaging and PCB assembly?
Yes. DELO MONOPOX adhesives are widely used in die attach, flip chip bonding, sensor bonding, PCB assembly and RFID applications. Their low ionic content makes them suitable for sensitive electronic assemblies.
What is the shelf life of DELO MONOPOX adhesives?
Shelf life depends on the grade and storage conditions. Most DELO MONOPOX grades require refrigerated or frozen storage before use to prevent premature curing.
Does Inseto provide technical support?
Yes. Inseto provides technical support for adhesive selection, dispensing processes, cure optimisation and production line integration across the UK and Ireland.
Further Information
Applications
Structural Adhesives – High Strength Mechanical Joining (Can Replace Soldering or Rivets); Casting Resins – Casting & Potting; Microelectronics – Die Bonding and Encapsulation for Chip-& Wire; Low Temperature Bonding for Temperature-Sensitive Substrates
Industry Segments
Electronics, Microelectronics, Consumer Electronics, Automotive Engineering, Mechanical Engineering, Construction Industries, Metal Processing, RFID & Smart Card
View more details about MONOPOX on the DELO Website
https://www.delo-adhesives.com/products/adhesives/detail/delo-monopox/
Region
Available from Inseto in the United Kingdom & Ireland
Request Form
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