Wire Bond Capillary
Wire Bonding Capillary Key Features:
- Capillaries for gold ball bonding and bumping applications
- Specific capillaries for copper and silver wires
- Standard and fine pitch capillary designs
- Suitable for all OEM manual and automated ball bonders
- For current and legacy equipment
- Many designs available ex-stock
Kulicke and Soffa (K&S) is the world’s leading manufacturer of advanced wire bond capillary tools for a broad range of applications from standard to ultra-fine pitch bonding of copper and gold wires, through capillary designs suitable for wafer level bump bond and capillaries suitable for manual ball bonding equipment.
K&S produce an extensive range of capillaries for Au & Cu wire, from large pitch (120 µm pad pitch) through ultra-fine pitch (35µm and below) applications. K&S capillaries are continuously developed to improve bond process reliability, equipment performance, looping characteristics, longevity and yield.
With over 40 years experiences, in providing end-to-end solutions to a wide array of customers applications, KnS provide wire bond capillaries to suit all major brands of equipment.
For information on common features and selection criteria for ball bond capillaries, please look at our Knowledge Base Fact Sheet here.
Wire Bond Capillary Downloads
File
K&S – Bonding and Bumping Capillary Product Selection Guide
Download
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Knowledge Base Articles
Description
Description
Kulicke & Soffa Capillary Nomenclature (IKB-011)
Link
Description
Ball Bond Sequence (IKB-001)
Link
Description
KnS Understanding Pattern Recognition (IKB-033)
Link
Description
Bonding Wire Sizes and Selection (IKB-037)
Link
Description
Bond Wire Handling Considerations (IKB-023)
Link
Description
Understanding Wire Pull Testing (IKB-003)
Link
Further Information
What are Wire Bonding Capillaries?
Wire bonding capillaries are high precision ceramic bonding tools used in semiconductor and microelectronic assembly to form electrical interconnections between a device die and a package substrate or leadframe. They are a critical component in ball bonding and bumping processes, where fine metal wire is guided, shaped, and bonded with controlled force, heat, and ultrasonic energy.
In ball bonding applications, the bonding wire, typically gold, copper, or silver, is fed through the central hole of the capillary. A free air ball is first formed at the wire tip and is then pressed onto the bond pad on the device. The capillary then controls wire looping and forms the second bond, commonly referred to as the stitch bond, on the substrate or leadframe.
Key characteristics of wire bonding capillaries include:
- Ceramic tools that transmit force, heat & ultrasonic energy during bonding process
- Critical to ball formation, placement accuracy, looping and second bond consistency
- Geometry and surface finish tailored to wire material, diameter and pad pitch design
- Available in a wide range of designs for stud bumping and ball bonding applications
Inseto Knowledge Base Document:
Read our free guide to “What is Wire Bonding?“
Wiki – Wire Bonding
Applications
Wire Bonding Gold Wire, Ball Bonding Copper Wire, Flip Chip Bump Bonding, Stud Bumps, Wafer Level Bump Bonding
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Kulicke & Soffa (K&S) Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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