Hermetic Ceramic and Metal Microelectronic Packages by Egide
Egide is a leading-edge manufacturer of high reliability hermetic packages, housings and enclosures. Founded in France in 1986, Egide has evolved to become a marquee name in the world of hermetic packages for critical applications with manufacturing plants in Europe and the US.
Certified to ISO 9001:2015, Egide offers consistently high quality products that are manufactured in an environmentally-friendly environment. All Egide products are manufactured to the industry-standard MIL-STD-883.
Egide designs and manufactures hermetic packages to protect and interconnect fragile electronic or photonic ICs, which are sensitive to harsh thermal, atmospheric, or magnetic environments. These packages are the product of complex expertise, drawing upon several disciplines: material structure, particularly specialised alloys, chemistry and surface treatment, mechanics and thermodynamics, electronics, optoelectronics, and high frequency modeling.
Egide is one of the few companies to master all of the technologies surrounding the two types of material used for these packages in the world today: glass-to-metal and ceramic-to-metal.
In its state-of-the-art manufacturing in Bollène, France, Egide manufactures both ceramic-sealed and glass-sealed hermetic packages. A 500 sq-metre Class 10,000 cleanroom designed specifically for treatment of raw ceramic ensures that the entire ceramic manufacturing process is completely controlled in-house. The same facility provides assembly, surface treatment and full control of glass-sealed packages, and includes Egide’s own glass bead manufacturing process.
A copy of Egide’s ISO Certificate can be downloaded here.
Egide’s Ceramic Design Guidelines can be requested from their website.

Explore the Egide Range of Hermetic Ceramic and Metal Microelectronic Packages
What are Hermetic Glass and Ceramic Microelectronic Packages?
Hermetic glass and ceramic microelectronic packages are sealed housings used to protect sensitive electronic and photonic devices from moisture, gases, and other environmental contaminants. By forming a gas‑tight barrier, these packages ensure long‑term reliability while providing electrical and thermal interconnection between the internal device and the external system.
Glass‑to‑metal and ceramic‑to‑metal sealing technologies are widely used where electronics must operate reliably in harsh environments, including high temperature, pressure, vibration, or chemically aggressive conditions.
Key characteristics of hermetic glass and ceramic microelectronic packages:
- Provide a true hermetic seal that prevents ingress of moisture, gases, and contaminants, supporting long‑term device reliability
- Manufactured using glass‑to‑metal and ceramic‑to‑metal sealing technologies for robust mechanical and environmental performance
- Enable reliable electrical interconnection and thermal management between internal devices and external circuitry
- Widely used in high‑reliability applications such as aerospace, military, telecommunications, industrial, and photonic systems
For information on hermetic glass and ceramic microelectronic packages, please refer to our Knowledge Base fact sheet: Die Attach Process: Guidance & Setup.

Knowledge Base Articles
Description
Setting up the Die Attach Process? (IKB-072)
Further Information
Wiki – Semiconductor Device Fabrication:
Applications for Hermetic Ceramic and Metal Microelectronic Packages
High Reliability Hermetic Packages, Microelectronic Hybrid Housings, Power Semiconductor Assemblies, Microwave Assemblies, Optical Packages, Thermal Imaging Sensors etc.
Industry Segments
Wireless, Internet Infrastructure, Military, Aerospace, Industrial, Telecommunications, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly etc.
Egide Website
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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