Sinter Die Attach and Inspection Equipment by AMX
AMX Automatrix manufactures a range of sinter press die attach equipment and surface acoustic microscopes for silver sintering or copper sintering and non-destructive inspection of die, leadframes and assemblies into power module, RF and other related semiconductor devices.
AMX is part of the COPROMEC Group of companies and started its business developing and manufacturing customised automation solutions for the electric-automotive industry, producing turnkey processing lines, stemming from a long internal experience and from an ethos of collaboration with clients.
AMX always considered innovation as the cornerstone of their philosophy and thanks to a continuous investment in research and engineering, AMX has developed and patented a complete range of die-attach sintering equipment.
The range of sinter press systems includes dedicated models for research and development applications, where a wide range of products in small volumes can be processed. In addition, AMX produce semiautomatic and fully automatic sinter presses, which incorporate the AMX patented “Micro-Punch” tool technology, providing optimum planarity on each die during the sinter process.
AMX Surface Acoustic Inspection Microscopes are available in either tabletop or inline configurations for semi or fully automatic inspection and quality control processes. Acoustic microscopy employs high-frequency ultrasounds to non-destructively penetrate materials to make visible images of internal features, including defects such as cracks, delamination’s and voids.

P50 Series – Manual Die Sintering Equipment
A series of manual sintering presses ideal for R&D on up to 300 x 300mm assemblies with up to 300kN.

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P100 – Semiautomatic Sinter Die Attach Tool
Semi-automatic sintering press equipped with AMX’s patented “Micro-Punch” tool

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P200 – Fully Automatic Sinter Die Attach Tool
Fully inline die sintering press for high volume production of power electronic modules and devices.

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X-Sam M51 Tabletop Scanning Acoustic Microscope
Tabletop SAM system to inspect sinter or solder reflowed power modules etc.

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X-Sam 200/300 Inline Scanning Acoustic Microscope
Fully in-line SAM system to inspect sinter or solder reflowed power modules.

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Further Information
What is Sinter Die Attach?
Sinter die attach is an advanced bonding process used to secure semiconductor dies to substrates or lead frames using a sintered metal layer, typically silver or copper. Unlike traditional soldering, sintering creates a highly reliable, void-free connection without requiring flux, making it ideal for high-power and high-temperature applications.
Key advantages of sinter die attach:
- Superior Thermal & Electrical Conductivity: Ensures efficient heat dissipation and stable electrical performance.
- High Reliability: Withstands extreme operating conditions, including high temperatures and thermal cycling.
- Flux-Free Process: Eliminates contamination risks and improves long-term device integrity.
This technology is widely adopted in power electronics, automotive, and industrial sectors for components such as IGBTs, MOSFETs, and high-power modules.
Inseto Knowledge Base Document:
Read our guide to the “Semiconductor Sintering Materials“
Wiki – Sintering
Applications
Die attach, Power Module Assembly, IGBT/DBC Attach, Leadframe Attach, Wafer Level Packaging, RF Module Assembly, etc.
Industry Segments
Power Semiconductor, RF & Microwave Electronics, Universities R&D, Aerospace and Hi-Reliability Devices etc.
AMX Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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