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Sinter Die Attach and Inspection Equipment by AMX

AMX Automatrix manufactures a range of sinter press die attach equipment and surface acoustic microscopes for silver sintering or copper sintering and non-destructive inspection of die, leadframes and assemblies into power module, RF and other related semiconductor devices.

AMX is part of the COPROMEC Group of companies and started its business developing and manufacturing customised automation solutions for the electric-automotive industry, producing turnkey processing lines, stemming from a long internal experience and from an ethos of collaboration with clients.

AMX always considered innovation as the cornerstone of their philosophy and thanks to a continuous investment in research and engineering, AMX has developed and patented a complete range of die-attach sintering equipment.

The range of sinter press systems includes dedicated models for research and development applications, where a wide range of products in small volumes can be processed.  In addition, AMX produce semiautomatic and fully automatic sinter presses, which incorporate the AMX patented “Micro-Punch” tool technology, providing optimum planarity on each die during the sinter process.

AMX Surface Acoustic Inspection Microscopes are available in either tabletop or inline configurations for semi or fully automatic inspection and quality control processes. Acoustic microscopy employs high-frequency ultrasounds to non-destructively penetrate materials to make visible images of internal features, including defects such as cracks, delamination’s and voids.

AMX Sintering Equipment

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

What is Sinter Die Attach?

Sinter die attach is an advanced bonding process used to secure semiconductor dies to substrates or lead frames using a sintered metal layer, typically silver or copper. Unlike traditional soldering, sintering creates a highly reliable, void-free connection without requiring flux, making it ideal for high-power and high-temperature applications.

Key advantages of sinter die attach:

  • Superior Thermal & Electrical Conductivity: Ensures efficient heat dissipation and stable electrical performance.
  • High Reliability: Withstands extreme operating conditions, including high temperatures and thermal cycling.
  • Flux-Free Process: Eliminates contamination risks and improves long-term device integrity.

This technology is widely adopted in power electronics, automotive, and industrial sectors for components such as IGBTs, MOSFETs, and high-power modules.

Inseto Knowledge Base Document:

Read our guide to the “Semiconductor Sintering Materials

Wiki – Sintering

Sintering Overview – Wikipedia

Applications

Die attach, Power Module Assembly, IGBT/DBC Attach, Leadframe Attach, Wafer Level Packaging, RF Module Assembly, etc.

Industry Segments

Power Semiconductor, RF & Microwave Electronics, Universities R&D, Aerospace and Hi-Reliability Devices etc.

Region

United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark

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