Adhesives for Electronic Applications
DELO adhesives for electronic applications are designed to support bonding, sealing, encapsulation and protection processes across a wide range of electronic assemblies. These electrical adhesives are used where electrical reliability, environmental protection and process control are critical throughout the product lifecycle.
Electronic assemblies often involve compact designs, mixed substrates and exposure to thermal cycling, vibration and humidity. DELO adhesive technologies are formulated to deliver controlled curing, consistent mechanical performance and long-term stability, supporting both precision manual assembly and automated, high-volume production environments.
Inseto supports customers across the UK and Ireland with application-specific adhesive selection, process optimisation and technical support for electronic manufacturing. Our team works alongside production and design engineers from first material trials through to a repeatable, qualified process on the line.
Start your enquiry by contacting us online now.
Where Are Adhesives For Electronics Used?
Typical electronic applications for DELO adhesives include:
- Component bonding and fixing on printed circuit boards.
- Sealing of connectors, switches and housings.
- Encapsulation and potting to protect assemblies from moisture, dust and mechanical stress.
- Glob top and dam and fill processes for wire bond protection.
- Bonding of sensors and miniature electromechanical components.
What Are The Bonding And Protection Challenges In Electronics?
Electronic assemblies place specific demands on adhesive materials. Key challenges include:
- Protection of sensitive components from moisture and environmental influences.
- Reliability under temperature cycling and vibration.
- Controlled curing close to heat-sensitive components.
- Compatibility with fine geometries and small bond lines.
- Stable electrical and mechanical performance over time.
DELO adhesives for electronics are engineered to address these challenges while maintaining high process stability, assembly yield and long-term reliability. Inseto’s technical team can help you select the right chemistry, test it against your specification and build it into a controlled production process. Contact us now for a quote or get in touch via enquiries@inseto.com or call +44 1264 334505.
Get in touch with enquiries about our range of DELO adhesive products
Send us an enquiry
Close


Explore Electronic Applications for DELO Adhesives
FAQs
What are electrical adhesives used for in electronic assemblies?
Electrical adhesives are used for bonding, sealing, encapsulation and protection across electronic assemblies. Common processes include component fixing on printed circuit boards, sealing of connectors, switches and housings, potting against moisture and dust, glob top and dam and fill for wire bond protection, and the bonding of sensors and miniature electromechanical components.
How do adhesives for electronics protect components from moisture and dust?
Encapsulation and potting cover the assembly in a cured adhesive layer that keeps moisture, dust and mechanical stress away from sensitive components. Glob top and dam and fill processes apply the same principle at a smaller scale, shielding wire bonds on the board.
Can DELO adhesives cure near heat-sensitive components?
Yes. DELO adhesive technologies offer controlled curing, which allows bonding close to heat-sensitive components without exposing them to damaging process temperatures. Curing behaviour is selected to suit the substrate combination and the assembly method in use.
How does Inseto support electronic manufacturers with adhesive selection?
Inseto works with electronic manufacturers across the UK and Ireland on application-specific adhesive selection, sample testing and process optimisation. We support projects from initial material trials through to stable, high-volume production.

Further Information
Applications
Bonding, Sealing, Encapsulation, Potting, Protection Against Vibration, Securing, Dam & Fill
Industry Segments
Microelectronic Assembly, Semiconductor Assembly, Fibre Optics, Photonic Devices, PCB Assembly, Electronic Component Assembly, Smart Cards, Smart Labels, RFID, Automotive Electronics, Mdeical Devices etc.
DELO Website
Region
United Kingdom and Ireland
Request Form












Back to top