Semiconductor Packages & Lids | Ex-Stock
Semiconductor Packages and Lids Key Features
- Ex-stock Metal and Ceramic Semiconductor Packages and Lids
- Extensive range of hermetic and plastic packages and lids in stock
- Full traceability on all items
- Ideal for universities, research institutes, prototyping and test requirements
Inseto provides an extensive ex‑stock range of semiconductor packages and lids, supporting fast turnaround requirements for research, prototyping, evaluation, and low‑volume production. Our inventory includes metal, ceramic, and plastic semiconductor packages, together with compatible lids, all supplied with full traceability and backed by Inseto’s specialist knowledge of microelectronic materials and assembly processes.
By offering a wide selection of packages from stock, Inseto enables customers to reduce lead times, minimise procurement risk, and accelerate development cycles across a broad range of electronic and microelectronic applications.
The ex‑stock portfolio includes a comprehensive selection of commonly used semiconductor package styles, supporting both hermetic and non‑hermetic assembly requirements. Available package types include:
- Power Transistor Outline (TO) packages
- Hybrid ceramic and metal packages
- Ceramic Pin Grid Array (CPGA) packages
- Ceramic Quad Flat Pack (CQFP) packages
- Ceramic Small Outline Packages (CSOP)
- Cerquads to EIJA and JEDEC standards
- CERDIPs and Cerpacs
- J‑lead and leadless chip carriers (LCC)
- Side‑braze packages
- Microwave transistor (Micro‑T) packages
- Plastic equivalent packages, including PPGA formats
- Matching lids for the above package types
This breadth of availability allows engineers to select packaging solutions that meet electrical, thermal, and environmental requirements without long manufacturing lead times.
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Further Information
What are Semiconductor Packages
Semiconductor packages are the protective housings used to contain and support semiconductor devices and integrated circuits. They provide a mechanical structure around the semiconductor die while enabling electrical connection to external circuitry and, where required, environmental and hermetic protection.
Packages are manufactured in a range of materials and formats, including ceramic, metal, and plastic, and are selected based on electrical performance, thermal management, environmental resistance, and application requirements.
Key characteristics of semiconductor packages include:
- Semiconductor packages protect sensitive semiconductor dies from physical damage, contamination, and environmental exposure.
- The packages provide defined electrical connections between the semiconductor die and the external circuit, typically through leads, pins, pads, or grid arrays.
- Many semiconductor packages are designed to dissipate heat generated by the device during operation.
- Semiconductor packages are available in numerous standardised and industry‑recognised formats, allowing them to be matched to specific electrical, thermal, and environmental requirements.
Inseto Knowledge Base Document:
Read our free guide to “What is Microelectronics Assembly?“
Wiki – Integrated Circuit Packaging
Applications
High Reliability Hermetic Glass And Ceramic Sealed Assemblies, High Reliability Glass Sealed Feed-Throughs, Ceramic Feed-Throughs, Microwave Assemblies, Detonator Fuses, Vacuum Seals, Optical Component Headers, Hermetic Switch Components, High Pressure Connectors, Military & Civil Aviation Connectors, Custom Sight Glass Windows, Die Bonding Sub-Mounts, Heat Dissipation / Heatsinks, Thermal Interface, Microwave Carriers, LDMOS, Power and Bi-Polar RF Transistor Packages, Laser Diode Substrates, Mounts and Blocks, RF Transistor Flanges and Bases, Seal Frames, Hermetic Packages & Enclosures, High Speed Digital Packages
Industry Segments
Microelectronic / Hybrid Assembly Industries, Semiconductor Assembly / Back-end Assembly etc., Fibre Optics / Photonic Assembly, Microwave Electronics, Military & Civil Aviation, Telecommunications, Satellite / Space Electronics, Oil Exploration & Production, Wireless Internet Infrastructure, Aerospace, Industrial, Power Semiconductor Assembly etc.
Region
Available from Inseto throughout Europe.
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