Microelectronic Assembly Tooling

Inseto supplies a comprehensive range of high‑precision microelectronic assembly tooling used throughout semiconductor and advanced electronics manufacturing. These tools are designed to support critical front‑end and back‑end processes where accuracy, repeatability, and process stability are essential.

Our tooling product range supports key assembly stages including wafer dicing, die handling, wire bonding, wedge bonding, and thermal joining, serving both R&D environments and high‑volume production lines. All tooling is sourced from established manufacturers and engineered to deliver consistent performance in demanding microelectronics processes. Inseto’s microelectronic assembly tooling range includes:

• ADT: Hubless dicing blades, including resin‑bond, nickel‑bonded, and metal‑bonded, designed for a wide range of applications, including metals, glass and advanced substrate materials.
• Kulicke & Soffa: Advanced hub dicing blades for wafer and package singulation, plus wire bonding capillaries for manual to automated equipment, including fine‑pitch and high‑reliability solutions.
• MPP: Precision‑manufactured tooling for interconnection, including bonding wedges, die collets, and associated tools for manual and automatic wire bond and die attach equipment.
• AIT: Hot bar thermodes and welding electrodes for thermocompression, thermosonic, and resistance bonding processes. Tools are designed for controlled heat transfer and repeatability.