Bond Test Equipment by Nordson Dage
Nordson DAGE manufactures a leading range of bond test equipment and micro-materials test equipment for the destructive and non-destructive testing of electronic components and related devices. The equipment is used worldwide for quality assurance and failure analysis purposes in the aerospace, automotive, consumer, medical and advanced technology sectors.
Bond test methods include wire pull, bond shear, die shear, tweezer pull, die stud pull etc., whilst micro-materials test methods include flex-bend and push-pull etc.
Nordson-DAGE systems are optimized for manual through to automated testing of microelectronic packages such as multi-chip-modules, chip scale packages, plus other electronic component and material test applications, such as connector testing, PCB material and substrates analysis etc.
Continuous hardware and software development has ensured that new machines and test methods are swiftly introduced. A philosophy that has most recently led to the development & introduction of the 4600 automated bond test system and the 4800 wafer level bond tester.
Bond Test Equipment: Stellar 4000
Accurate high speed bond testing, including wire pull, bond shear, die shear and pull etc.
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Automated Bond Test Equipment: 4600
Operator free wire pull or shear testing, utilizing high accuracy motion control and on-board camera’s.
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Automated Wafer Level Bond Tester: 4600-W
Developed to address the specific needs of wafer bond bump shear testing on up to 450mm dia. wafers.
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Bond & Micro Materials Test Equipment: 4000 Plus
The Nordson DAGE4000 Plus is the most advanced bond tester on the market, ideal for QA & FA applications, plus materials test methods.
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Bond Test & Material Test Methods
An overview of the different type of bond test and micro-materials test methods performed on Nordson-DAGE bond testing equipment.
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Further Information
What is Bond Testing in Microelectronics?
Bond testing is a mechanical test method used to evaluate the strength and reliability of interconnections within microelectronic assemblies. These interconnections, such as wire bonds, solder joints, die attachments, and bumps, are critical for the electrical and thermal performance of semiconductor devices. A single weak bond can lead to device failure, making bond testing an essential step in quality assurance and process control.
The process involves measuring the force needed to break or stress a bond, either destructively (to ultimate failure) or non-destructively (to a predefined limit). Common microelectronic test types include:
- Pull Test – Determines strength by pulling wires or ribbons, non-destructively or until failure.
- Die Shear Test – Applies a lateral force to assess die attach joint integrity
- Bond Shear – Applies a lateral force to assess wire bond or bump joint integrity.
Inseto Knowledge Base Documents:
Read our guides to “Understand Wire Pull Testing” or “Understanding Shear Test: Ball & Die Shear“.
Wiki – Semiconductor Device Fabrication
Applications
Semiconductor Defect Analysis & Process Characterisation, Wire Bond Testing, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Materials Testing, Die Shear & Bond Shear Strength Checks, Bump Wafer Test, Micro-Materials Testing, Fatigue, Creep, Flex-Bend, Crush, Push/Pull etc.
Industry Segments
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Fibre Optics / Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
Nordson-DAGE Website
Visit the Nordson website: www.nordson.com
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Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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