Nitride Wafer – Si₃N₄ Coatings
Our high performance nitride coated wafers come in many diameters, thicknesses, and coating types. This allows for precise customization to suit specific device, process, and application requirements.
What is a Nitride Wafer?
An Si₃N₄ wafer refers to a silicon wafer coated with silicon nitride (Si₃N₄), a compound composed of silicon and nitrogen. Silicon nitride is known for its high mechanical strength, excellent thermal stability, chemical resistance and electrical insulation properties.
These wafers are commonly used in semiconductor manufacturing for applications such as dielectric layers, passivation coatings, diffusion barriers, and membranes.
Key Features of Nitride Wafers
- Premium Grade Silicon Nitride Coated Semiconductor Wafer
- Nitride thickness and uniformity, nanometres to several microns
- Available on a variety of substrate materials, including silicon
- Si₃N₄ Wafer Coatings using PECVD or LPCVD processes
- Single or Double-Side Coatings (process dependent)
- Wafer Dicing Service
- Supply and Shipment Worldwide from Stock
Buy Si₃N₄ Nitride Wafers online
We maintain a large inventory of different Nitride wafer types for rapid dispatch. Browse our “Online Semiconductor Wafer Store” to view current stock and technical specifications.
- Extensive Inventory: A wide selection wafer sizes & thicknesses
- Fast Global Shipping: Rapid dispatch from our UK warehouse
- Custom Processing: Wafer thinning, dicing, bumping and more
- Expert Support: Technical advice to help you select the right wafer
- No Minimum Order: Perfect for both R&D and production environments
- Quality Assurance: All wafers undergo rigorous inspection processes
Nitride Wafers for demanding Semiconductor and Microelectronic and Research Applications
Inseto supplies silicon nitride wafers with high purity Si₃N₄ coatings manufactured using advanced chemical vapour deposition processes. These coating methods ensure outstanding thickness uniformity, surface finish and dielectric performance, making our nitride wafers ideal for demanding semiconductor, microelectronic, and research applications.
Silicon nitride films are valued for their excellent chemical resistance, electrical insulation, mechanical strength and thermal stability. Nitride film coatings also act as effective passivation layers, etch masks, and diffusion barriers, offering long-term reliability and protection in harsh processing environments.
About the Nitride Wafer Coating Processes
Nitride wafers (Silicon Nitride Si₃N₄) are produced by using either Plasma-Enhanced Chemical Vapour Deposition (PECVD) or Low-Pressure Chemical Vapour Deposition (LPCVD).
PECVD silicon nitride is used for smaller quantities and allows better control over film stress and refractive index by adjusting the silicon content and excitation frequency. PECVD is a line-of-sight deposition process, which only coats one side of the wafer.
LPCVD silicon nitride is preferred for larger batches (e.g. 25 wafers or more) and produces highquality stoichiometric films with low stress, especially effective for thin layers under 100 nm. It coats both sides of the wafer and is ideal for uniformity and purity.
Nitride Wafer Coating Process Methods
To produce silicon nitride (Si₃N₄) coatings on wafers, the process typically involves chemical vapour deposition (CVD), either LPCVD (Low-Pressure CVD) or PECVD (Plasma-Enhanced CVD). The specific gases used to produce the coating varies slightly depending on the method.
LPCVD (Low-Pressure Chemical Vapour Deposition)
- Dichlorosilane (SiH₂Cl₂) – a silicon source
- Ammonia (NH₃) – a nitrogen source
These gases react at high temperatures (typically 700–900°C) and low pressure (<1 Torr) to form a uniform Si₃N₄ film. The gas flow ratio, temperature, and pressure are critical in determining the film’s mechanical and optical properties
PECVD (Plasma-Enhanced Chemical Vapour Deposition)
- Often uses silane (SiH₄) or tetrafluorosilane (SiF₄) as the silicon source
- Ammonia (NH₃) or nitrogen (N₂) as the nitrogen source
- Plasma is used to enhance reaction rates at lower temperatures
Ion Implantation
This is a process used to embed dopant ions into the surface of a wafer with high precision. In the case of nitride wafer coatings, it can be applied before or after film deposition. This helps to change the substrate characteristics, or improve surface properties. While nitride layers like Si₃N₄ are usually deposited via LPCVD or PECVD, ion implantation can improve adhesion, tailor electrical characteristics, and create stress profiles beneficial for MEMS and power devices. It’s especially valuable for applications requiring uniform doping, controlled electrical behaviour, or enhanced mechanical performance.
Got a Question About Nitride Wafers?
Curious about semiconductor materials and how to choose the right nitride wafer? Explore our “Semiconductor Wafer Selection Guide” for expert insights. You’ll also find a wealth of information in our free “Knowledge Base“, covering semiconductor processes, technologies, and more.
Choosing the right Nitride wafer can be complex, especially if you’re unsure about specifications or material types. That’s why Inseto offers expert guidance to help you make the best choice for your application.
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help. From selecting the right semiconductor wafer to onsite training, we provide technical guidance, documentation, and support for your production needs.
Applications for Nitride Wafers
Key Applications
A nitride wafer is a versatile substrate used across a wide range of semiconductor and microfabrication processes.
- The coating is widely used in CMOS and MEMS fabrication as a dielectric layer due to its excellent electrical insulation, chemical resistance, and mechanical strength. It also serves as a passivation layer, protecting circuits from moisture and contamination.
- Si₃N₄ is a key material in photonic integrated circuits. Its low optical loss, wide transparency range (400–2350 nm), and high refractive index make it ideal for waveguides, resonators, and optical filters.
- Thanks to its tunable stress and mechanical robustness, silicon nitride is used in suspended membranes for MEMS sensors and actuators. It also serves as a substrate for 2D material exfoliation.
Nitride Wafers Product Range
Wafer Specifications
- Si₃N₄ Silicon Nitride: PECVD or LPCVD
- Oxide Thickness: Nanometres up to 2 microns
- Available in: Single or Double-Side Coatings
- Available on: a variety of substrate materials & thicknesses
- Available on: FZ, CZ & Intrinsic Silicon Wafers
- Wafer Diameters: 100 mm (4″), 150 mm (6″), 200 mm (8″), 300 mm (12″)
- Optional Features: Dicing, Laser marking, flat or notch orientation, backside oxide
- Supply and Shipment: Worldwide
Knowledge Base Articles
Related Products
Further Information
Wiki – Silicon Nitride Wafer Description
Nitride Wafer Applications
2D Materials Exfoliation, Graphene Research, Power Electronics, Medical Devices, CMOS, Microfluidics, MEMS Devices, Sensors, Renewables, Solar Cells, Energy Harvesting etc.
Industry Segments
Semiconductor & Related Research and Manufacturing, Coating Development, Adhesion Testing etc.
Region
You can buy Nitride Wafers directly from Inseto with fast delivery available worldwide.
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