Manual Wire Bonder by MPP
Inseto proudly supplies the advanced iBond series of manual wire bonder from Micro Point Pro (MPP). With over 30 years of expertise in wire bonding technology, MPP’s equipment is trusted globally for microelectronic assembly, R&D, and low-volume production.
Manual Wire Bonders by MPP:
- iBond5000 Ball Bonder – Ideal for gold wire ball bonding and stud bumping with a copper wire option.
- iBond5000 Wedge Bonder – Designed for ultrasonic wedge bonding using aluminium or gold wire.
- iBond5000 Dual Bonder – A convertible system supporting ball bonding and deep access wedge bonding.
MPP’s manual bonders are engineered for precision, repeatability, and ease of use. This makes them ideal for applications in semiconductor packaging, MEMS, biomedical devices, and optoelectronics.
Key Features of MPP Manual Ball & Wedge Bonders
Featuring a powerful combination of precision, flexibility, and ease of use, each system supports both manual and semi-automatic operation modes, with an intuitive touchscreen interface for streamlined control. Users can customise bond parameters and save process profiles for repeatability.
The machines are designed for bonding 18µm to 75µm gold, copper, and aluminium wires and up to 250µm x 25µm ribbons. They are suitable for thermosonic, ultrasonic, and single-point TAB bonding. This range and flexibility makes them the ideal choice for many microelectronic packaging applications.
Wire Bonding Applications Across Industries
MPP’s manual wire bonders are trusted across a wide range of industries. These include microelectronics, aerospace, defence, medical electronics, photonics, fibre optics, automotive, and semiconductor assembly. They are also widely used in academia and research, where the equipment’s precision and flexibility are essential for prototyping and development work. This versatility makes them ideal for both production environments and laboratory settings.
Why Choose the MPP Manual Wire Bonder from Inseto?
- Expertise in wire bonding process development and optimisation
- On-site training and installation services available
- Custom tooling, bonding wedges, and capillaries for all major OEMs
- Demonstration and evaluation units available upon request
- Decades of experience in microelectronics and semiconductor assembly
- Comprehensive after-sales support, including maintenance and calibration
Need help choosing the right wire bond machine or tools for your process? Our team is ready to assist with expert guidance and solutions, to get in touch: enquiries@inseto.co.uk or call: +44 1264 334505.
Manual Wedge Bonder: iBond5000Wedge
The latest generation of manual wedge bonder from MPP for ultrasonic fine wire bonding.
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Manual Ball Bonder: iBond5000Ball
An advanced manual wire bonder for gold wire bonding or bumping (copper optional).
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Convertible Wire Bonder: iBond5000 Dual
Convertible wire bonder between wedge or ribbon bonding and ball bonding with deep access wire feed.
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Manual Wire Bonding Tools
Ultrasonic bonding wedge’s for wire and ribbon bonding, developed for all OEM equipment models.
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Further Information
What is a Manual Wire Bonder?
A manual wire bonder is a precision machine used in microelectronics to create electrical connections between semiconductor devices and their substrates or packages. Manual wire bonders depend on the operator for positioning and bonding. This makes them great for low-volume production, research and development, prototyping, and repair work.
The system typically support wedge bonding, ball bonding, and ribbon bonding techniques. They use materials such as aluminium, gold, or copper wire to form the electrical connections. The bonding process involves applying ultrasonic energy, heat, and mechanical pressure to form reliable interconnects between chips and carriers.
Key Components of a Manual Wire Bonder:
- Bond Head: Holds the tool and applies ultrasonic energy for bonding.
- Wire Feed System: Guides bonding wire from spool to tool.
- Manipulator: Allows manual X-Y movement for precise placement.
- Control Electronics: Manages ultrasonic power and bonding parameters.
- Force Actuator: Regulates pressure applied during the bonding process.
- Workholder: Secures the device or substrate, sometimes with heating.
Inseto Knowledge Base Document:
Read our free guide to “What is a Wire Bonding?“
Wiki – Wire Bonding Overview:
Wire Bonding Applications:
Microelectronic Devices, Chip-on-Board Assemblies, Microwave Devices, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nanoelectronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development
Industry Segments
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Nano Electronics, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
MPP Manual Wire Bonder Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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