Sintering Materials by Inventec
Inventec Performance Chemicals develops and supplies advanced sintering materials designed to meet the evolving demands of modern electronics manufacturing. These materials enable high-performance, high-reliability, and environmentally responsible solutions for power electronics and semiconductor packaging.
What is Sintering?
Sintering is a solid-state joining process that uses heat and pressure to bond materials at the microscopic level without melting.
In semiconductor assembly, sintering materials are rapidly becoming the preferred alternative to traditional soldering due to their compatibility with wide bandgap semiconductors (e.g., SiC, GaN), superior thermal and electrical conductivity, high mechanical strength and fatigue resistance and lead-free and halogen-free formulations.
Key Features of Sintering Materials
- Sintering materials for die attach, component attach, and substrate attach
- Compatible with SiC, GaN, and other high-power semiconductor devices
- High thermal conductivity: >300 W/m·K
- High shear strength: >50 MPa
- Excellent thermal cycling reliability: >1000 cycles from -55 °C to +125 °C
- Lead-free, halogen-free and no nanoparticles
- Pressure and Pressure-less sintering materials formulations
Sintering Materials Resources
Inventec Sinter Paste Flyer
Ecorel SINTEC AP90 Low Pressure Print Grade Paste
Ecorel SINTEC AP90D Low Pressure Dispense Grade Paste
Ecorel SINTEC AP92 Low Pressure Print Grade Paste
Ecorel SINTEC XP95 Pressure-Less Print Grade Paste
Ecorel SINTEC XP95D Pressure-Less Dispense Grade Paste
Sintering Materials Applications
Inventec’s sinter materials are engineered for a wide range of demanding applications, including:
- Power modules in electric vehicles, renewable energy systems, and industrial automation
- Semiconductor packaging for high-performance computing and AI
- High-frequency and high-voltage electronics in telecom and aerospace
- Advanced thermal management in compact, high-power devices
Sustainable Innovation
Die attach, component attach and substrate sintering materials from Inventec are developed with a strong focus on eco-design and process efficiency:
- Free from CMR substances and nanoparticles
- Room temperature storage with long shelf life
- Low-pressure sintering for reduced equipment costs
- Stencil-printable for scalable manufacturing
- Reduced energy consumption during processing
These features make them ideal for manufacturers seeking to reduce environmental impact while improving product performance and reliability.
What are Die Attach Sintering Pastes?
Die attach sintering pastes are advanced semiconductor packaging materials used to bond a semiconductor die to a substrate, leadframe or package by a sintering process rather than conventional soldering or epoxy curing. They are most commonly silver‑based pastes formulated with fine metal particles that bond together when heat, and sometimes pressure, is applied.
During sintering, the metal particles fuse to form a solid metallic joint. This creates a highly reliable electrical and thermal interface between the die and the substrate, without the joint melting during normal device operation.
Key Characteristics of Die Attach Sinter Pastes include:
- High thermal conductivity: Significantly higher thermal traditional die attach materials
- High temperature stability: The metallic bond is more stable than conventional solder
- Electrical conductivity: The metallic bond interface results in low electrical resistance
- Lead free: Alternative to high temperature die attach solders
Got a Question About Inventec’s Sintering Materials?
Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help.
From selecting the right sintering materials or specifying sintering equipment to optimising your processes, we provide technical guidance, documentation, samples and on-site training to support your application needs.
Knowledge Base Articles
Related Products
Further Information
Wiki – Sintering
Applications
Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Power Module Assembly, Leadframe Attach, Package Construction & Sealing, Attaching, Wafer Level Packaging, RF Module Assembly etc.
Industry Segments
Semiconductor Production, Power Semiconductor Assembly, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microelectronics, Semiconductor Back-end Assembly, Universities, Passive Component Manufacturing.
Inventec Website – Sintering Materials
www.inventec.dehon.com/solutions/soldering/sintering-solutions/
Region
Available from Inseto in the United Kingdom and Ireland
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