Microelectronic Cover Assemblies & Semiconductor Package Lids
Cover Assemblies & Package Lids Key Features
- Metal & ceramic cover assemblies
- Fully automated handling with vision system
- Consistent, repeatable high-quality parts
- Minimal raised material in weld area
- Tightly controlled weld penetration
Coining Cover Assemblies (package lids) offer many advantages for the hermetic sealing process of electronic packages over techniques using separate solder preforms and covers. The base material is electroplated with nickel for solderability and to prevent corrosion in the future. The part is then electroplated with gold to provide a highly solderable surface.
Designed and manufactured by Coining, they provide the necessary hermetic seal for delicate electrical components in even the harshest of environments. Coining cover assemblies improve on the traditional methods of assembly, aligning and attaching individual parts by supplying one integrated cover assembly that mates to the package.
Cover Assembly Base Composition: Typically Kovar™ or Alloy 42. Aluminium alloys, Titanium and Stainless Steel are available upon request.
Plating: Typically Nickel plating per QQ-N-290, 50 – 350µ” thick followed by Gold electroplating per MIL-G-45204, Type III, Grade A, 50µ” thick minimum. Alternate plating schemes, including four-layer plating and customer specific thicknesses, are available upon request. Base will meet the requirements of MIL-M-38510.
Processing Information: We recommend a typical clip force of 0.9 – 2 lbs. Clip force varies depending on lid cover size, preform thickness, lid flatness, and seal-ring flatness. Typical sealing profiles allow for 2 – 5 minutes above 280°C (melting temperature) with a peak temperature not exceeding 340°C in dry nitrogen, or hydrogen.
Cover Assemblies & Package Lids Technical Downloads
File
Coining Cover Assemblies Brochure
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File
Coining Company Brochure
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Further Information
What are Microelectronic Cover Assemblies
Microelectronic cover assemblies are integrated package lids used to seal and protect sensitive semiconductor and microelectronic devices after die attach and wire or ribbon bonding. They form a controlled enclosure over the active components, providing mechanical protection and, where required, a hermetic seal that prevents the ingress of moisture, gases, and contaminants.
During package sealing, the attached solder seal is reflowed under controlled temperature and atmosphere conditions, allowing the solder to wet the package seal ring and form a continuous, void‑free bond between the cover assembly and the package.
By combining the cover and sealing frame into a single assembly, these components simplify package sealing, improve alignment accuracy, and support consistent, high‑reliability assembly processes in demanding environments.
Key characteristics of microelectronic cover assemblies:
- Designed to provide reliable environmental protection and, where required, hermetic sealing of microelectronic packages
- Supplied as integrated cover and frame assemblies to improve alignment, reduce handling steps, and enhance sealing yield
- Solder seals are reflowed during assembly to create a continuous metallurgical bond between the cover and package seal ring
- Widely used in high‑reliability applications including semiconductor packaging, aerospace and defence electronics, photonics, RF and microwave devices
Inseto Knowledge Base Document:
Read our free guide to the “Die Attach Process: Guidance & Setup“
Wiki – Integrated Circuit Packaging
Solder Preforms & Precision Metal Stamping Applications
Die Bonding, Material Interconnect, Heat Dissipation, Thermal Interface, Package Construction & Sealing, Attaching, Soldering etc.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Region
Available from Inseto in the United Kingdom, Ireland & Nordic Region
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