Hub Dicing Blades by K&S
Key Features
- High quality wafer dicing blade
- Wide range of grit sizes and variable bond hardness
- Choose from different diamond concentrations
- Reduced vibration for superior cut quality
- HCL series – Low cost of ownership, silicon wafer dicing
- HPL-SiC Series – High performance SiC dicing blade
- PS Max series – Long-life, package singulation dicing blade
- Hub dicing blades for all OEM equipment
Kulicke and Soffa (K&S) manufactures a full range of hub wafer dicing blade for a variety of advanced applications and materials, including cutting of silicon and compound semiconductor wafers, and for package singulation. The blades are suitable for use on all OEM manual and automatic wafer saws, including ADT, Disco, Accretech, Loadpoint etc.
Over three decades of experience in sophisticated dicing blade technology have shown that meeting the desired objectives for cut quality, throughput and blade life requires matching the material to be cut, with the appropriate blade composition and geometry, including various grit sizes, diamond concentrations, bond hardness’s and hub configurations.
The K&S range of hub dicing blades for cutting silicon, compound semiconductor and other semiconductor wafer materials, and for package singulation include:
- The HCL series of hub wafer dicing blades provide a competitive solution to silicon wafer dicing with superior cut quality and precision.
- The HPL-SiC series of silicon carbide dicing blades are designed for dicing with higher throughput, whilst eliminating lateral cracks and maximising blade life.
- The PS Max series of package singulation dicing blades provide an advanced solution for semiconductor package singulation with reduced cost of ownership and extended blade life.
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Further Information
What is a Hub Dicing Blade?
A hub dicing blade consists of the diamond cutting ring permanently mounted onto a rigid metal hub, typically aluminium. This integrated construction allows the blade to be mounted directly onto the spindle of the dicing saw without additional flanges or adapters.
The hub provides structural stability and accurate centring, and offers stable rotation and consistent run‑out performance. This makes them ideal for production environments where repeatability, reduced setup time and predictable cutting performance are important.
Key characteristics of hub dicing blades include:
- Integrated design with a rigid metal hub permanently bonded to the cutting edge
- Direct spindle mounting without a separate flange
- Stable, low‑vibration cutting with rotational stability at high speeds
- Suitable for dicing silicon, compound semiconductors and packaged devices
Inseto Knowledge Base Document:
Read our guide to the “Dicing Blade Selection“
Wiki – Die Singulation
Applications
Dicing Silicon Wafers, Compound and other Semiconductor compositions, cutting hard materials including Glass, Ferrite, Precision Metal Parts and Dicing Thin Film Substrates etc.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics Components, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices
Kulicke & Soffa (K&S) Website
Region
Available from Inseto in Denmark, Finland, Germany, Ireland, Netherlands, Portugal, Sweden and United Kingdom
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