Inseto

SOI Wafer for Research & Production

Our SOI wafers are available with device layers over 1.0 to 300 microns and come in sizes from 75mm (3″) to 200mm (8″) in diameter. We can also produce bonded SOI wafers with oxide on the backside as well as laser marking on front or backside.

What is an SOI Wafer?

An SOI wafer (Silicon on Insulator wafer) is a layered semiconductor substrate composed of a thin silicon (Device) layer, a buried oxide (BOX) insulating layer, and a thick silicon base wafer (Handle).

Key Features of SOI Wafers

  • PRIME grade high-quality SOI wafer
  • Exceptional device layer TTV control
  • 3” to 200mm SOI wafers available
  • Bonded SOI from device layers of 1.0um to >300um
  • Any dopant and Si orientation
  • Backside with oxide coating and laser marking available
  • Supply and Shipment Worldwide from Stock or on short lead times
  • Buy silicon on insulator wafers online

Buy SOI Wafers online

We maintain a large inventory of different SOI wafer types for rapid dispatch. Browse our “Online Semiconductor Wafer Store” to view current stock and technical specifications.

  • Extensive Inventory: A wide selection wafer sizes & thicknesses
  • Fast Global Shipping: Rapid dispatch from our UK warehouse
  • Custom Processing: Oxide and nitride deposition, wafer thinning and more
  • Expert Support: Technical advice to help you select the right wafer
  • No Minimum Order: Perfect for both R&D and production environments
  • Quality Assurance: All wafers undergo rigorous inspection processes

Delivering PRIME-grade bonded wafers

Inseto is a leading Silicon on Insulator wafer supplier (SOI Wafer), offering PRIME-grade bonded wafers with exceptional device layer flatness and Total Thickness Variation (TTV). Bonded SOI wafers are manufactured through a precise and multi-step process that involves joining two silicon wafers with an insulating oxide layer in between.

What are bonded wafers?

Bonded SOI wafers are manufactured through a precise and multi-step process that involves joining two silicon wafers with an insulating oxide layer in between.

Why use Bonded SOI Wafers?

The layered structure of SOI wafers offers a number of performance benefits when compared to bulk silicon, including:

  • Simplified Fabrication: The isolation provided by the BOX layer can reduce the need for complex isolation techniques like deep trench isolation used in bulk silicon processes.
  • Reduced Parasitic Capacitance: The buried oxide (BOX) layer in SOI wafers acts as an insulator, significantly lowering parasitic capacitance between the device layer and the substrate. This leads to faster switching speeds and lower power consumption.
  • Improved Isolation: Devices built on SOI wafers are electrically isolated from the substrate, reducing cross-talk and latch-up issues common in bulk silicon designs.
  • Better Thermal Management: The insulating layer helps limit heat dissipation into the substrate, improving thermal performance and enabling higher device density.
  • Enhanced Radiation Resistance: SOI structures are more resilient to radiation-induced charge collection, making them ideal for aerospace and military applications.

Got a Question About SOI Wafers?

Curious about semiconductor materials and how to choose the right silicon wafer? Explore our “Semiconductor Wafer Selection Guide” for expert insights. You’ll also find a wealth of information in our free “Knowledge Base“, covering semiconductor processes, technologies, and more.

Choosing the right Silicon on Insulator wafer can be complex, especially if you’re unsure about specifications or material types. That’s why Inseto offers expert guidance to help you make the best choice for your application.

Whether you’re developing a new product or refining an existing process, Inseto’s team of experts is here to help. From selecting the right semiconductor wafer to onsite training, we provide technical guidance, documentation, and support for your production needs.

Applications for SOI Wafers

Key Applications

Trusted by research institutions and production facilities worldwide, Inseto’s SOI wafers are used in a range of advanced semiconductor applications in MEMS, CMOS, power electronics, microfluidics, and medical devices etc. Key applications include:

  • Advanced Microprocessors: SOI technology reduces parasitic capacitance, improving switching speed and energy efficiency, which is ideal for microprocessors, mobile devices, and high-performance computing.
  • RF/HF Devices: In RF and high-frequency applications, the insulating BOX layer minimises signal loss and substrate coupling, making SOI wafers suitable for 5G components, RF switches, and millimetre-wave devices.
  • Medical and Microfluidic Devices: SOI wafers are used in biomedical sensors and microfluidic platforms where precise control of electrical and mechanical properties is essential. The BOX layer acts as a barrier, enabling isolated sensing regions and reducing interference.
  • Photonics and Optical Communications: SOI wafers are a cornerstone of photonic integrated circuits (PICs). Their ability to support light confinement and propagation makes them ideal for next-generation optical networks.
  • Radiation-Hardened Electronics: SOI devices are inherently more resistant to radiation effects making them valuable in aerospace, military, and nuclear electronics.
  • Semiconductor Research and Development: Inseto’s SOI wafers are used extensively in academic and industrial R&D for device prototyping, process development and material testing.

SOI Wafers Product Range

Wafer Specifications

  • SOI Wafer sizes from 3” to 200mm, some in inventory
  • Very high quality with tight TTV on device layer thickness
  • Direct Si-Si bonding and double sided SOI available
  • Any Si orientation, any device thickness over 1.5um
  • Single and double side polished
  • Small lot sizes and Laser marking of wafers available
  • Short lead time delivery

Knowledge Base Articles

Related Products

Further Information

Contact Us

Tel: +44 (0)1264 334505

Email: enquiries@inseto.co.uk

Wiki – SOI Wafer Description

Silicon on insulator – Wikipedia

SOI Wafer Applications

High-performance Logic and Computing, RF and Wireless Communications, Low-power Electronics, Automotive and Harsh Environment Electronics, MEMS and Sensors, Silicon Photonics, Radiation-hardened Systems

Industry Segments

Semiconductor Research and Fabrication, Telecommunications and RF electronics, Consumer Electronics, Data Centres and High-performance Computing, Automotive and Mobility, IoT and Edge Devices, Aerospace and Defence, Photonics and Optical Communications

Region

You can buy SOI Wafers directly from Inseto with fast delivery available worldwide.

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