PEO-604 Semiconductor Furnace
PEO-604 Key Features
- Small footprint wafer furnace for up to 200mm diameter wafers
- Up to 100 programmable process steps & unlimited process recipes
- Energy saving by zero energy consumption at ambient / standby
- Multiple processes by easily exchangeable quartz In-Liners
- Excellent ramping rates, up to 1000°C in less than 15 minutes
- < 1ppm Oxygen with 2 times vacuum-N2-backfill routine
ATV’s PEO-604 is a quartz tube semiconductor wafer furnace for oxidation and annealing, processes etc.
The system accommodates wafers up to 200mm in diameter, with a flat zone within the furnace for up to 50 wafers (temperature uniformity +/- 1.5°C, over 150mm batch). Furnace body is hermetically sealed providing < 1 ppm Oxygen contact with 2 x vacuum N2 back fill routines. Windows based process recipe generation and management system: 100steps per recipe, Step length 1s – 99:59min, process data logging, several user levels, Barcode management and a PLC Controller.
Designed for volume production through wall installation is possible while still retaining easy to access service hatches for preventative and routine maintenance. The PEO 604 has low energy and gas consumption with zero energy loss at Ambient Standby.
The systems are high quality, reliable production tools capable of continuous operation and rapid switching between a variety of complex processes without contamination using the novel “in-liner” principle.
PEO-604 Technical Downloads
File
ATV PEO Furnace Model Range Datasheet
Download
ATV In-liner Concept Overview
PEO-604 in-liner principle for wet/dry thermal oxidation and annealing with gas inlet through door bell jar ball joint into In Liner – by this method, a clean atmosphere is maintained inside it, scarifying the original process tube
- Run multiple processes in the same furnace
- Prevents cross contamination across different processes
- Prevents deposition outside in-liner
- In-liners are replaceable without leak-check
- Flexible with wafer boats
- Easy to replace
PEO-604 Example Application
Thermal oxidation of silicon
- Wet oxidation using H2O bubbler for various applications e.g. MEMS
- Thick oxides e.g. 3 μm SiO2 (30h at 1100°C)
- Automatic water refill setup
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Further Information
What is a semiconductor quartz tube furnace?
A quartz tube furnace is essentially a high-temperature electric furnace featuring a quartz tube chamber. Quartz is chosen because of its high purity, excellent thermal stability, and chemical inertness, which are critical for semiconductor processes that demand contamination-free environments. A semiconductor furnace typically includes:
- Heating elements arranged around the quartz tube.
- Temperature control systems for precise thermal management.
- Gas handling systems for controlled atmospheres (e.g., nitrogen, oxygen, or dopant gases).
Wiki – Semiconductor Device Fabrication
Applications
Wet Oxidation, Dry Oxidation, P Type Diffusion, N Type Diffusion, Annealing, Vacuum Baking, Thick Film Firing, Glass Paste Firing, and Multiple Processes without cross contamination by ATV’s easily replaceable Quartz In-liner System. Carbon nano tubes, Graphene, solar cell, Polyimide/BCB curing, wafer bump reflow, alloying.
Industry Segments
Universities, Research Development, Semiconductor Production, Medical, Photonics, LTCC, Solar Cell, Photo Voltaic, CNT, Compound Fabrication etc.
ATV (A Kurtz Ersa Semicon Company) Website
https://kurtzersa.com/products/electronics-production/semicon
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway, Denmark & Baltics
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