Rapid Thermal Processing Equipment (RTP / RTA) by Unitemp
UniTemp manufactures and develops rapid thermal processing equipment (RTP / RTA) for the fabrication of MEMS, semiconductor and microelectronic devices in both industrial and academic settings. Applications include rapid thermal annealing processes, SiAu, SiAl, SiMo alloying, Low K Dielectrics, thick film paste firing etc.
UniTemp’s RTA / RTP equipment features excellent uniformity. The models are front-loaded single wafer processing tools, ideal for research, development and small series production requirements. With a wide range of process gas capabilities, including N2, O2, H2, Ar, & Forming Gas and substrate sizes up to 300mm in diameter, the compact RTA / RTP systems are the ideal solution for multiple thermal processes.
Additional features of the ovens include Oxygen and moisture measurement, high-vacuum specific configurations and inline operation (VPO-300 model only). Other products manufactured by Unitemp include high-precision programmable hotplates for use in all applications.
RTP Ovens
Rapid Thermal Process Oven with ramp up rate up to 200K/s for wafers and substrates up to 200 mm diameter.
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Vacuum Process Oven
Vacuum RTP oven for wafers and substrates up to 300 mm diameter with ramp up rate up to 40K/s down to 10-6mBar.
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Hot Plates
Compact programmable hotplates for use in all applications. For substrate sizes up to 300mm
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Further Information
What is Rapid Thermal Processing (RTP) Equipment?
Semiconductor Rapid Thermal Processing (RTP) equipment is designed to heat semiconductor wafers to very high temperatures, often up to 1200–1500 °C within seconds or minutes, followed by controlled cooling to prevent thermal stress. This rapid heating is typically achieved using high-intensity infrared lamps in a precisely controlled environment, often under vacuum or with specific process gases such as oxygen, nitrogen, hydrogen, or forming gas.
RTP systems are essential in semiconductor fabrication for processes such as:
- Dopant activation after ion implantation
- Thermal oxidation and nitridation for thin dielectric layers
- Silicide formation and metal reflow for low-resistance contacts
- Annealing and crystallization to repair lattice damage and improve material properties
Modern RTP tools, like those offered by UniTemp, feature single-wafer processing, fast ramp rates (up to 200 K/s), excellent temperature uniformity, and advanced gas control.
Wiki – Semiconductor Device Fabrication
Applications
Annealing; SiAu, SiAl, SiMo Alloying; Low k Dielectrics, Post Implanting Annealing and Thick Film Paste Firing, Solder Reflow, Curing, Baking, Wire Bonding, Die Attach etc.
Industry Segments
Semiconductor Wafer Fabrication, Research, Quality Assurance, Microelectronics Production, Thin and Thick Film Electronics, Electronic Assembly
Unitemp Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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