Wafer Bonder by SUSS
SUSS develop and manufacture a full range of wafer bonder, including manual equipment for R&D and pilot production, through semi to fully automatic models for production level bonding.
The range of permanent and non-permanent equipment is designed for MEMS, advanced packaging, 2.5 & 3D integration, power devices and led applications, plus de-bonders for thin wafer applications.
Capabilities include low-high force bonding, anodic bonding, thermo-compression bonding, eutectic bonding, glass frit bonding, fusion & adhesive bonding etc.
XB8 Wafer Bonder
Universal high-force wafer bond system for up to 100kN and Temperature up to 550°C
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SB6/8 Gen2 Wafer Bonder
Semi-automatic tool for permanent wafer bonding of wafers up to 8″ / 200mm
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XBS200 Wafer Bonder
Automated bond cluster platform for wafer sizes up to 200mm
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SUSS
See the full SUSS product range
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Further Information
What is Permanent Wafer Bonding?
Permanent wafer bonding is a semiconductor manufacturing process in which two or more wafers are permanently joined together to form a single, integrated structure. The bonding is performed at wafer level and enables the combination of different materials, device layers, or functional elements within a single assembly.
The technique is widely used in MEMS, optoelectronics, advanced packaging, and three‑dimensional device integration, where it supports high alignment accuracy, mechanical stability, and, in some cases, hermetic sealing.
A range of bonding methods may be used depending on the application, including direct bonding, anodic bonding, eutectic bonding, and adhesive bonding.
Key characteristics of permanent wafer bonding:
- Permanent joining of two or more wafers at wafer level
- Enables three dimensional integration and heterogeneous material stacks
- Supports high alignment accuracy and mechanical stability
- Suitable for MEMS, sensors, optoelectronics, and advanced packaging applications
Inseto Knowledge Base Document:
Read our guide to the “What is a Wafer Bonder?“
Wiki – Semiconductor Device Fabrication
Applications
Wafer and Substrate Lithography, Wafer Coating and Cleaning Processes of Micro-Fluidic Devices, Power Semiconductors, MEMS Devices, Compound & GaN, Photonic Components etc.
Industry Segments
Semiconductor Wafer Fabrication, University Research and Development
SUSS Website
Region
United Kingdom, Ireland, Sweden, Finland, Norway & Iceland
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