Wire Bonder | Ball, Bump and Wedge Bond
Kulicke & Soffa (K&S) offer a comprehensive range of automated wire bonding equipment designed to meet the performance, reliability, and throughput demands of modern semiconductor and microelectronics manufacturing.
Covering ball bonding and stud bumping, wedge bonding, and advanced interconnect processes, K&S systems combine high precision motion control with proven process stability to support applications ranging from R&D and pilot production, through to high‑volume manufacturing.
Renowned for their continual development and innovation, K&S wire bonders are widely used throughout the automotive, power electronics, and advanced packaging sectors.
Stud Bumping Equipment
Stud bumping is an advanced interconnection technique used in semiconductor packaging. It is used for flip-chip, wafer-level packaging and stacked die configurations. Models capable of this advanced bump process comprise:
- AT Premier PLUS: is a high-speed precision wafer-level bonder designed for stud bumping.
- RAPID Pro: supports advanced wire bond and bump bond processes with real-time diagnostics.
Ball Bonding Equipment
Ball bonding is the most widely used interconnect method in semiconductor and microelectronic packaging. K&S offers a portfolio of automatic ball bonders designed for high-performance semiconductor interconnect using gold, copper or silver wires. These machines combine precision, speed, and smart manufacturing features to meet the demands of Industry 4.0.
- RAPID Pro: supports advanced ball and bump bonding processes with precision control.
- POWERCOMM: A cost-effective solution for ball bonding discrete devices with high performance.
Wedge Bonding Equipment
Wedge bonding is commonly used in industries that require high reliability, directional control of wire placement, and compact connections. It is especially suitable for automotive electronics, radio frequency and microwave modules, medical devices, sensor assemblies, battery cell bonding and power electronics. The technique supports aluminium and gold wire in both round and ribbon formats. This makes it ideal for applications involving high current, fine pitch layouts, and components sensitive to heat.
K&S wedge bonders are recognised for their reliability, precision, and suitability for demanding applications, models comprise:
- Asterion: Versatile platform with a 300 x 300 mm bond area for fine and heavy wires and large ribbon bonding.
- Asterion EV: An extended version with a bondable area of 300 x 860 mm enhancing flexibility.
- Asterion SV: Tailored for wire bonding batteries with enhanced ultrasonic performance and process control.
- PowerFusion Series: a cassette to cassette or inline lead-frame bonder for power semiconductor devices
Automatic Ball Wire Bonder – Rapid Pro
Engineered for advanced packaging requirements with response based programming.
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Wafer Stud Bump Bonder – AT Premier
The AT Premier™ Stud Bump Bonder is the ideal choice for a wide range of wafer bumping applications.
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Wedge Wire Bonder – Asterion
Suitable for fine and large wire or large ribbon bonding of microelectronic devices.
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Wedge Bonder – Asterion-EV
An expanded bondable area for bonding large wire and ribbons in microelectronic devices and battery packs.
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Battery Wire Bonder – Asterion-SV
Features the largest bondable area designed for ultrasonic bonding of cylindrical cell battery packs.
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Power Semiconductor Wedge Bonder – PowerFusion
Designed for cassette to cassette or inline lead-frame wedge bonding of power semiconductor devices.
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Wire Bonding Capillaries
K&S offers a full range of capillaries and large wire wedges suitable for K&S and other OEM systems.
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K&S – Kulicke and Soffa
See the full K&S product range
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Further Information
What is a Wire Bonder?
A wire bonder is a precision machine used to interconnect semiconductors and microelectronics devices. It creates electrical connections between integrated circuits (ICs) and their packaging with fine metal wires. These connections are essential for enabling communication between the chip and the outside world.
Wire bonding machines use different bonding methods like ball bonding or wedge bonding based on the application. Ball bonding is ideal for high-density and fine-pitch connections and uses gold, silver or copper wires. Wedge bonding uses aluminum or copper wire and is preferred for power electronics and high-reliability assemblies. This method is also used when devices cannot be heated during processing.
Modern machines offer high precision, speed, and versatility, making them indispensable tools in industries ranging from consumer electronics to automotive and aerospace.
Key Components of a Wire Bonder include:
- Bond Head: Holds the bond tool, applies ultrasonic energy & force during bonding.
- Ultrasonic System: Generates high-frequency vibrations for the bonding processes.
- Wire Feed System: Guides and clamps the wire from its spool to the bond tool.
- User Interface: Enables programming of bond parameters and wire positions.
- Motion Control: Moves the bond head in multiple axes for accurate wire placement.
- Vision System: High-resolution cameras for bond alignment & post-bond inspection.
- Workholder: Secures the device or substrate, sometimes with heating.
Inseto Knowledge Base Document:
Read our free guide to “What is a Wire Bonding?“
Wiki – Semiconductor Device Fabrication
Applications:
Microelectronic Devices, Chip-on-Board Assemblies, Microwave Devices, Multi-Chip-Modules, Semiconductor Components, Development, Microelectronic Devices, Bio Medical Assembly, Nanoelectronics, MEMS Device Interconnect, Chip-on-Board Assemblies, Multi-Chip-Modules, Semiconductor Components, Development
Industry Segments
Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonics, Solar Cell, Nano Electronics, Fibre Optics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities
Kulicke & Soffa (K&S) Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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