Technical Support Services by Inseto
Inseto Technical Support Key Features
- OEM Trained Support Personnel
- Process Reviews & Improvements
- Machine Repairs & Breakdowns
- Certified Maintenance & Calibrations
- Annual Support Contracts
- Equipment & Process Training Classes
Inseto provides comprehensive technical support services for capital equipment used across semiconductor, microelectronics and advanced packaging environments. Our engineering and applications teams work closely with customers and equipment manufacturers to ensure reliable installation, efficient issue resolution and sustained process performance throughout the life of the equipment.
Technical support is a core part of Inseto’s value to customers. Our engineers combine equipment knowledge with practical process understanding, enabling support that goes beyond basic service activities.
Deep technical expertise
Inseto’s technical support capability is delivered by experienced, factory trained service engineers and applications specialists with direct exposure to production environments. Support is provided by engineers who understand both the equipment and the manufacturing processes it supports.
Our team supports equipment involving:
- Precision bonding, assembly and interconnect processes
- Semiconductor fabrication and advanced packaging
- Process critical materials and consumables
- High accuracy motion, vision and thermal systems
This process led approach allows Inseto to support not only equipment operation, but also stability, repeatability and long term performance.
Your technical partner
Inseto’s technical support services are relied upon by customers operating critical manufacturing processes where equipment availability, yield and process control are essential. Our approach is built on technical competence, practical experience and long term customer support.
All of our work is carried out in accordance with the manufacturers guidelines using comprehensive service checklists, calibrated instruments, OEM warrantied parts and is certified according to our ISO accreditation & procedures.
Inseto Technical Support Technical Downloads
File
Inseto Wire Bonder Training Course Datasheet
Download
Technical & Application Support
Support across the full equipment lifecycle
Inseto provides structured technical support from initial planning through to ongoing production use, helping customers protect their capital investment and reduce operational risk. Our technical support services include:
- Professional Accredited Support
- OEM Approved Service
- Annual Service Level Contracts
- Equipment & Process Training Classes
- ISO Certified Maintenance & Calibration
Inseto’s technical support services are relied upon by customers operating critical manufacturing processes where equipment availability, yield and process control are essential. Our approach is built on technical competence, practical experience and long-term customer support.
Some customer testimonials:
Testimonial 1: Thank you for your recent service intervention; by travelling up the evening before to get an early start on Monday, we were able to resume production earlier following completion of your work.
Testimonial 2: Great training yesterday. Very well received by the guys..!!!
Testimonial 3: The technical support we have received in resolving issues with our dicing saw has been tremendous. The timely intervention has enabled us to meet our customers requirements, this has just led to the purchase of another ADT dicing system from Inseto!
Testimonial 4: Inseto recently provided us with a first service for two pieces of equipment. The service engineer arrived promptly, at the beginning of our working day. The engineer was friendly and well presented. He showed great understanding of the equipment and further complimented our own understanding by sharing some of his. He identified problems that had surfaced during the servicing and made us aware of what to look for in the future. We were completely satisfied with the level of serviced received. Our equipment is now running more efficiently which has subsequently increased yield and the quality of the devices which pass through them, thank-you.
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Further Information
Applications
Semiconductor Wafer Defect Analysis & Characterisation, Validation Of Process & Machine Setup, In Process Quality Control, Wire Bond Strength Analysis, Die Shear & Bond Shear Strength Checks including: Ball Shear/Solder Ball Shear, Cold Bump Pull, Die Shear, First Bond Ball Pull/Stud Bump Pull, High Force Pull, High Strain Rate, Pull, Stud Pull, Tweezer Pull, Zone Shear, Flip Chip Bump Test
Industry Segments
Power Device Production, Universities, Research Development, Production, Semiconductor, Medical, Photonics, Solar Cell, Photo Voltaic, RF & Microwave Electronics, Microelectronics etc.
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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