Materials Division

Inseto provides a comprehensive range of high-performance microelectronic assembly materials and machine consumable tools designed to support critical processes, such as dicing, bonding and interconnect. These products are essential for the assembly and packaging of semiconductor, photonic, RF, and related technologies, and are trusted by manufacturers and research institutions for their precision, reliability, and consistent quality.

Microelectronic Material Products

Our range of Microelectronic Assembly Materials includes high-performance adhesives for die attach and encapsulation. We supply bonding wires and ribbons ideal for precision interconnects. For advanced packaging, our sintering pastes offer excellent thermal and electrical conductivity. We also provide solder preforms, ribbons, and precision stampings for controlled soldering processes. Our portfolio includes thick film pastes and glazes for hybrid circuit fabrication, as well as thin film substrates tailored for high frequency applications. Our thermal management materials enhance heat dissipation, and a selection of hermetic packages in both metal and ceramic formats, ensure long-term device protection.

Microelectronic Machine Consumable Tools

Inseto offers a comprehensive selection of machine consumable tools designed to support high-precision microelectronic assembly processes. Our range includes dicing blades, available in both hubbed and hubless formats, for clean and accurate wafer separation. We supply die pickup tools and bonding collets engineered for delicate handling and placement of components. For wire bonding applications, we provide bonding wedges and capillaries that ensure consistent and reliable connections. Additionally, we offer welding electrodes and thermodes for precision micro-joining applications.