Hubless Dicing Blades and Accessories by ADT
ADT manufacture an extensive range of high-quality, hubless dicing blade types, also known as annular blades, to suit a wide variety of cutting and scribing applications, including dicing ceramic (LTCC, Alumina etc.) glass, metals, sapphire, ferrite and silicon etc.
ADT’s continually develop their hubless blades to provide reduced wear and improved life with high dimensional accuracy, resulting in precision dicing and excellent cost-of-ownership (CoO).
Choosing the right blade to suit your application is crucial to the success of your dicing process. To offer the widest range of process capabilities, ADT produces three different product families of hubless blade, which are composed of abrasive materials embedded in either resin or metal matrix, including: resin blades, nickel blades and metal sintered blades.
Resin bond dicing blades are cured under pressure and high temperature, metal-bond blades are sintered and nickel-bond blades are manufactured using a tightly controlled electroforming process.
Explore the ADT Range of Hubless Dicing Blades
Resin Hubless Dicing Blades
Excellent choice for hard and brittle materials, e.g.: Ceramic, Quartz, Glass QFN HTCC etc.
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Nickel Hubless Dicing Blades
Provides longer blade life and lower wear rate, ideal for softer materials such as: PCB, Silicon and BGA etc.
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Sintered Hubless Dicing Blades
Slower wear rate than Resin hubless but faster than Nickel, ideal for: BGA, Soft Alumina, TiC, LTCC, Ferrite etc.
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Annular Dicing Blade Flanges & Accessories
Available for all blade types in the range of 2″- 5″.
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What are Hubless (Annular) Dicing Blades?
Hubless (Annular) dicing blades are thin, free‑standing diamond cutting rings supplied without a supporting hub. They must be mounted onto the dicing equipment using separate flanges, which determine the required blade exposure. This design provides greater flexibility in blade thickness and diameter selection, but it also means final cutting accuracy is influenced by the quality of mounting and alignment during setup.
Hubless blades are highly configurable and are ideal for a wide-range of applications, including cutting brittle and hard materials. They are often selected when fine kerf control or frequent blade changes are required.
Key Characteristics of Hubless Dicing Blades include:
- Hub‑free: Blades manufactured without an integrated metal hub
- Mounting via blade flange: Final accuracy influenced by mounting alignment
- Ultra‑thin blade capability: Ideal for narrow kerf widths
- Process range: Available in multiple materials for a wide range of dicing applications
For guidance on the key properties to consider during blade selection, please refer to our Knowledge Base fact sheet: Hubless Dicing Blade Selection.
Knowledge Base Articles
Further Information
Wiki – Die Singulation
Hubless Dicing Blade Applications
Dicing Semiconductor Wafers and Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic, Cutting Glass & Glass Filters, Dicing MEMS, Package Dice, PCB Separation, Universities Wafer Processing, Passive Component Manufacturing, Medical Devices, Glass Filter Cutting etc.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing etc.
ADT Website
Region
ADT’s Hubless Dicing Blade are available from Inseto in the United Kingdom, Ireland & Nordic Region
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