Wafer Coating and Developing Equipment by SUSS
SUSS develops and manufactures an extensive range of high-quality manual, semi-automatic and fully automatic wafer coating and developing equipment for lithographic processes used in the R&D and production of semiconductor and related devices.
The manual product line of SUSS includes spin coaters, spray coaters and hot plates available in stand-alone or bench mounted configurations.
Semi-automated solutions includes equipment for coating, developing, lift-off and cleaning processes, with models specific for either solvent and aqueous chemistries. These products also offer easy recipe transfer to automated platforms.
SUSS also specialise in the development and production of fully automated track based cluster tools for up to 200 or 300mm wafers. The systems for resist coating and or developing, can feature up to 3, 5 or 6 modules (ACS200), with up to four independent wet process and a maximum of 19 hot plates, to suit the needs of either high-volume manufacturing, or precision low-volume automated processing.
SUSS wafer coating and developing equipment is also renowned for its exceptional build quality, high yield, reliability and low cost of ownership.
See our “Knowledge Base Document” for a guide to photo-resist coating methods.
Manual Spin Coater
LabSpin Spin Manual Coating machine for accurate, high quality wafer coat or develop.
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Manual Wafer Hot Plate
The HP8 manual hot plate for up to 200mm wafers/substrates designed to meet the requirements of R&D work and small scale production.
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ECD8 Compact Resist Coater or Developer
The compact ECD8 combines flexibility, safety, and ease of use for substrates up to 200 mm.
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Semi-Automatic Resist Coat and Developers
The RCD8 is a custom configurable spin coat and resist develop platform.
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Manual Wafer Coating System
The MCS8 LabCluster is a custom configured tool-set for coating and developing wafers and substrates.
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Automatic Cluster Coating-Developing Track Equipment
The SUSS ACS200 Gen3 platform is a fully automated Coater & Developer platform.
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Semi-Automatic Spray Coaters
The AS8 series dual-line Spray Coaters for up to 200 mm wafers or substrates.
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SUSS
See the full SUSS product range
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Further Information
What is Wafer Coating?
Wafer coating is a critical step in semiconductor and microelectronic manufacturing, where a thin, uniform layer of photoresist or other functional material is applied to a wafer surface. This coating enables precise patterning during lithography and ensures high-quality device fabrication.
Key aspects of wafer coating include:
- Uniformity: Achieving consistent resist thickness for accurate pattern transfer.
- Material Control: Applying resists or coatings tailored to process requirements.
- Process Integration: Preparing wafers for subsequent fabrication process steps.
Modern wafer coating systems, like those from SUSS, use advanced spin-coating and spray-coating technologies to deliver exceptional precision and repeatability, supporting applications in semiconductor, MEMS, advanced packaging, and wafer-level optics.
Inseto Knowledge Base Document:
Read our guide to the “Introduction to Photoresist Coatings“
Wiki – Semiconductor Device Fabrication
Wafer Coating and Developing Equipment Applications
UV Lithography, Wafer Resist Coating with Spin, Spray or Puddle Dispense, Resist Developing, Wafer Cleaning, Metal Layer Lift Off, Baking, Wafer Prime etc.
Industry Segments
Wafer level chip-scale packaging, flip chip packaging, bumping, MEMS, LED, power devices, optical components and compound substrates and other semiconductor related device R&D applications
SUSS Website
Region
United Kingdom, Ireland, Sweden, Finland, Norway & Iceland
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