Die Bond Tools and Collets
Die Bond Tools and Collets Key Features
- High quality die attach tooling for all die bond equipment types
- Die Collets, Pickup Tips, Eject Needles and Stamping Tools etc.
- Extensive range of tip styles available for all applications
- Available with quick lead-times
Micro Point Pro (MPP) die bond products also include die collets and pick up tools, manufactured from various metallic (stainless steel, tungsten carbide or titanium carbide) and non-metallic (PVC, MSP, Vespel or Derlin) materials to suit almost any application including eutectic bonding.
The Die Bonding process takes place prior to wire bonding. The selected die is placed in a package and mechanically connected using either eutectic or adhesive die attach methods.
Die collets are used when the process requires high accuracy for the positioning of the die. They allow for minimal contact between the die and the attachment tool and provide a strong grip, especially in the eutectic die bonding and on MEMS devices where the upper surface cannot be contacted.
The Flat Face Pick Up tool is used in a Thermo-compression or Epoxy Die Attach process for picking up, holding, transferring and placing a die on the substrate.
MPP offers a comprehensive selection of Vacuum Pick Up tools for various applications, from ambient to high temperature resistant materials, including plastics, ceramics and metal based, dependent upon the required die-attach process.
In addition, MPP also manufacture die eject needles and epoxy stamping tools, including bar, star & pin patterns. These tools are suitable for use with all common die bonding machine models.
Die Bonding Tools and Collets Technical Downloads
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MPP Die Bonding Tools
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Related Products
Manual Die Bonders
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Automatic Die Bonders
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Bond and Materials Test Equipment
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Die Attach Adhesives
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Solder Preforms / Ribbon
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Knowledge Base Articles
Description
Description
Adhesives for Die Attach (IKB071)
Link
Description
Die Attach Process: Guidance and Setup (IKB-072)
Link
Description
Understanding Shear Test: Ball Bond and Die Shear (IKB-018)
Link
Description
Explanation of Low Pressure Plasma Cleaning (IKB-014)
Link
Description
Solder Die Attach For High Power Applications (IKB-016)
Link
Further Information
What are Die Bond Tools & Collets?
Die bond tools, including pickup tips and collets, are used to accurately pick, place, and secure semiconductor die during the assembly of microelectronic devices. Correctly specified die attach tooling ensures devices are assembled without damage, while maintaining precise bond line control and repeatable die placement.
The quality of the die bonding tooling has a direct impact on device performance, reliability, and yield.
Key characteristics of die bond tooling include:
- Precision and accuracy with the tools engineered to extremely tight tolerances.
- Ensures accurate pickup and placement of the semiconductor die
- Wide range of materials and designs to suit multiple processes
- Key factor in device performance, reliability, and manufacturing yield
Inseto Knowledge Base Document:
Read our free guide to the “Die Attach Process: Guidance & Setup“
Wiki – Integrated Circuit Packaging
Applications
Die Bonding, Eutectic Die Attach, Soft Solder Die Bond, Die Sorting, Flip Chip, Epoxy Die Bond etc.
Industry Segments
Semiconductor, Automotive, Aerospace, Military, Telecommunications, Medical Electronics, Photonic Assembly, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Medical Devices
MPP Website
Region
United Kingdom, Ireland & Scandinavia/Nordic Regions: Finland, Sweden, Norway & Denmark
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