Dicing Equipment and Consumables by ADT
Advanced Dicing Technologies Ltd. (ADT) is a world leader in the development and manufacture of dicing equipment used to dice and scribe semiconductor wafer and other hard material’s including glass, ceramic, ferrite, MEMS and for package singulation.
Established in 2003 following the acquisition of Kulicke and Soffa’s (K&S) former dicing equipment and blade divisions, ADT now manufactures an extensive range of dicing machines include dicing saws, wafer mounter’s, wafer washing systems, UV tape curing equipment, re-circulation and filtering systems, plus a wide range of dicing blades for all applications.
ADT offers dicing equipment and accessories, with a variety of capabilities and levels of automation to suit an ever-growing range of customer requirements. Combining their expertise in dicing machines and annular dicing blades, they bring their customers a complete range of dicing solutions.
View our “Knowledge Base document” for guidance on selecting the right annular dicing blade for cutting or scribing applications.
Manual & Semi-automatic Wafer Mounters
Manual and semi-automatic wafer mounters for bubble free adhering of wafers or devices to UV or standard blue tapes.
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Manual & Semi-automatic Dicing Equipment
ADT offer the most comprehensive range of manual and semi-automatic dicing systems.
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Fully Automatic Dicing Equipment
The 7220 models deliver substantially higher productivity compared to existing dicing systems, while minimizing the cost of operation.
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Peripheral Dicing Equipment
ADT offer a broad range of peripheral equipment that, along with their dicing systems, provides comprehensive and complementary solutions.
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Dicing Blades & Accessories
ADT manufacture a wide selection of annular dicing blades and flanges.
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Further Information
What is Wafer Dicing?
Wafer dicing is the process of cutting a semiconductor wafer into individual chips or die. This step occurs after wafer fabrication and is essential for producing discrete devices used in electronics. The process involves mounting the wafer onto a dicing tape and frame or ring, then using precision saws equipped with diamond blades to separate the wafer into smaller units.
Key aspects of wafer dicing include:
- Uniformity: Achieving consistent results requires precise control of cut quality, reduction of chipping, and effective contamination management. Critical factors include selecting the right blade, optimizing spindle speed, and ensuring proper cooling throughout the process.
- Materials: Wafer dicing is commonly performed on silicon wafers, but also extends to glass, ceramics, ferrites, precision metal components, and compound semiconductor substrates.
- Process: High-speed spindles equipped with diamond blades precisely cut the wafer into individual die, ensuring accuracy and efficiency throughout the dicing operation.
Inseto Knowledge Base Document:
Read our guide to the “Dicing Blade Selection“
Wiki – Die Singulation
Applications
Dicing of Semiconductor Wafer, Cutting Hard Materials, Cutting Precision Metal Parts, Dicing Thin Film Substrates, Cutting Ferrites, Scribing & Dicing Ceramic Components, Cutting Glass & Glass Filters, Dicing MEMS, Package Singulation etc., PCB Assembly Industries, Universities Wafer Processing, Passive Component Manufacturing, Separating Medical Devices.
Industry Segments
Semiconductor Production, Military & Aerospace, Telecommunications, Medical Electronics, Fibre Optics / Photonics, Microwave Electronics, Microelectronics, Power Semiconductor Assembly, Semiconductor Back-end Assembly, PCB Assembly Industries, Universities, Passive Component Manufacturing, Medical Devices, Glass Device Processing.
ADT Website
Region
ADT’s dicing equipment is available from Inseto in the United Kingdom, Ireland & Nordic Region: Denmark, Sweden, Finland and Norway
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